75th Annual Gaseous Electronics Conference
Volume 67, Number 9
Monday–Friday, October 3–7, 2022;
Sendai International Center, Sendai, Japan
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Session Index
Session DM1: Opening Ceremony
Chair: Toshiro Kaneko, Tohoku UniversitySendai International Center Tachibana
Session DM2: Workshop I: Industrial Plasma Technologies
Chair: Hajime Sakakita, National Institute of Adv Industrial Science and Technology; Taisei Motomura, National Institute of Advanced Industrial Science and TechnologySendai International Center Tachibana
Monday, October 3, 2022
DM2.00001: Modeling and Simulation of Plasmas for Etch Applications Invited Speaker:
Jason Kenney
Monday, October 3, 2022
DM2.00002: Thermal cyclic atomic-level etching in 3D ULSI device fabrication Invited Speaker:
Hiroto Ohtake
Monday, October 3, 2022
DM2.00003: Lunch
Monday, October 3, 2022
DM2.00004: New challenges on semiconductor plasma manufacturing processes Invited Speaker:
Tsuyoshi Moriya
Monday, October 3, 2022
DM2.00005: Applications of plasma-enhanced deposition technologies in the semiconductor industry Invited Speaker:
Jaeho Kim
Monday, October 3, 2022
DM2.00006: Coffee Break
Monday, October 3, 2022
DM2.00007: Quantitative Control of Plasma and Surface Reactions for Dielectric Film Etching Invited Speaker:
Tetsuya Tatsumi
Monday, October 3, 2022
DM2.00008: Plasma for a clean and carbon-neutral world Invited Speaker:
Dae Hoon Lee
