Bulletin of the American Physical Society
75th Annual Gaseous Electronics Conference
Volume 67, Number 9
Monday–Friday, October 3–7, 2022;
Sendai International Center, Sendai, Japan
The session times in this program are intended for Japan Standard Time zone in Tokyo, Japan (GMT+9)
Session DM2: Workshop I: Industrial Plasma Technologies
10:30 AM–5:00 PM,
Monday, October 3, 2022
Sendai International Center
Room: Tachibana
Chair: Hajime Sakakita, National Institute of Adv Industrial Science and Technology; Taisei Motomura, National Institute of Advanced Industrial Science and Technology
Abstract: DM2.00004 : New challenges on semiconductor plasma manufacturing processes
1:30 PM–2:15 PM
Presenter:
Tsuyoshi Moriya
(Tokyo Electron Limited)
Author:
Tsuyoshi Moriya
(Tokyo Electron Limited)
Optimization of the PEALD film-thickness uniformity within a wafer was carried out by an engineer and by the ML approach, both separately. Such a wide variation of uniformity was attributed to the initial conditions. The engineer could not settle the variation of uniformity after the five trials, which was effectively settled by the ML approach. The results suggest that the ML approach can find the optimum condition quickly and settle the variation.
Once the key parameter is suggested via ML, the desired target in the extrapolation area is achievable by human judgment. Fundamentally, a learning result can be transferred when the process conditions are similar. Thus, it is efficient to build a database by using data that are relatively easy to obtain.
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