Bulletin of the American Physical Society
2023 APS March Meeting
Volume 68, Number 3
Las Vegas, Nevada (March 5-10)
Virtual (March 20-22); Time Zone: Pacific Time
Session N74: Superconducting and Semiconductor Qubits I/O, Packaging, and 3D Integration IFocus Session
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Sponsoring Units: DQI Chair: Joseph Glick, IBM TJ Watson Research Center Room: Room 403/404 |
Wednesday, March 8, 2023 11:30AM - 12:06PM |
N74.00001: Module development of Si quantum technology for a practical quantum computer Invited Speaker: Jiun-Yun Li Si-based qubits are promising for their long spin decoherence and VLSI compatibility. In the past decade, physicists have demonstrated great progress on qubit physics and Si six-qubits was reported recently. To build up a practical quantum computer, there are still hurdles to overcome from an engineering perspective. Critical modules require intensive investigation, such as material growth of 28Si-enriched Si/SiGe heterostructure, ESR/EDSR devices for multi-qubit control, quantum CAD for qubit design, peripheral I/O access circuits, and cryo-CMOS characterization and SPICE modeling. In this talk, I will briefly introduce our strategy and show preliminary results at National Taiwan University (NTU) and Taiwan Semiconductor Research Institute (TSRI), Taiwan. |
Wednesday, March 8, 2023 12:06PM - 12:18PM |
N74.00002: Measurements of superconducting qubits containing through-silicon vias Thomas M Hazard, Wayne Woods, Rabindra Das, David K Kim, Jeffrey Knecht, Justin L Mallek, Bethany M Niedzielski, Donna-Ruth W Yost, William D Oliver, Jonilyn L Yoder, Mollie E Schwartz Superconducting qubits have developed from proof-of principle single-bit demonstrations to mature deployments of many-qubit quantum processors. With increased processor size comes the need for vertical input/output capabilities, which previously motivated the development of high-density superconducting thru-silicon vias (TSVs) for connecting grounds and route signals from opposite sides of substrate chips1. The potential utility of a TSV goes far beyond signal routing, in particular, a high-aspect-ratio TSV has a large capacitance that makes it a powerful tool for miniaturizing the largest-footprint components of superconducting quantum processors including the readout resonators and even qubits themselves. In this work we demonstrate compact TSV-enabled lumped-element resonators that provides vertical readout integration at a pitch smaller than that of a standard transmon qubit. We additionally demonstrate high-coherence transmon qubits for which TSVs provide the shunting capacitance, shrinking the on-chip footprint of the qubit by a factor of 10. We provide a bound on the loss in the TSV capacitor and discuss its possible future use in different superconducting qubits. ? |
Wednesday, March 8, 2023 12:18PM - 12:30PM |
N74.00003: Qubit fabrication in advanced semiconductor manufacturing facilities: the good, the bad, and the ugly* Kristiaan De Greve, Danny Wan, Massimo Mongillo, Yann Carvel, Clement Godfrin, Tsvetan Ivanov, Julien Jussot, Stefan Kubicek, Roy Li, Shana Massar, Daniel Perez Lozano, Antoine Pacco, Anton Potocnik, A. M. Vadiraj, George Simion, Alexander Grill The performance of modern superconducting and spin qubits, including their fidelity and homogeneity, is limited by material quality issues – especially, interfacial purity and cleanliness. The advanced process control in modern, industry- and foundry-grade manufacturing facilities can result in ultraclean and well controlled interfaces, while providing stringent limitations in the allowed processing methods. In this talk, we present recent results on improvements over the state-of-the art in interface and materials control in both superconducting and silicon spin qubit platforms: best-in-class quality factors of superconducting resonators [1], ultra-low charge noise in MOS spin qubits, and initial results in reduced variability for superconducting qubits [2]. At the same time, the incompatibility of relatively simple techniques such as lift-off with those advanced processing methods results in major constraints for qubit manufacturing. Overcoming those constraints while still leveraging the advantages in process control is the ugly side, the progress of which we will describe in detail. |
Wednesday, March 8, 2023 12:30PM - 12:42PM |
N74.00004: A 3-tier stack for 3D integration of superconducting quantum systems – part 1: Interposer tier with superconducting TSVs and qubits Donna-Ruth W Yost, Cyrus F Hirjibehedin, Justin L Mallek, Danna Rosenberg, Rabindra Das, Kate Azar, Katrina Silwa, Thomas M Hazard, Vladimir Bolkhovsky, Evan Golden, David K Kim, Jeffrey Knecht, Alexander Melville, Bethany Niedzielski, Meghan Schuldt, Ravi Rastogi, Kyle Serniak, Steven J Weber, Wayne Woods, Scott Zarr, Andrew J Kerman, William D Oliver, Mollie E Schwartz, Jonilyn L Yoder Complex systems of superconducting qubits present engineering challenges for robust control and readout of multi-qubit systems. We have developed a 3D integration approach that utilizes a 3-tier stack to provide access to multi-level superconducting circuitry. The 3D integrated stack is composed of a top qubit tier, a bottom superconducting multichip module (SMCM) tier, and an intermediate interposer tier. The interposer separates the qubits from the SMCM tier, reducing the impact of lossy dielectrics in the multilevel wiring of the SMCM on the coherence of the qubits. An active interposer tier with superconducting TSVs provides both connectivity and enhanced functionality with additional layers for resonators, qubits, and novel qubit devices which utilize the TSVs. We will discuss fabrication and characterization of our 3-tier stack platform for control and readout of multi-qubit systems. |
Wednesday, March 8, 2023 12:42PM - 12:54PM |
N74.00005: A 3-tier stack for 3D integration of superconducting quantum systems – part 2: qubit design and performance Cyrus F Hirjibehedin, Donna-Ruth W Yost, Justin L Mallek, Danna Rosenberg, Rabindra Das, Kate Azar, Katrina Sliwa, Thomas M Hazard, Vladimir Bolkhovsky, Evan Golden, David K Kim, Jeffrey Knecht, Alexander Melville, Bethany Niedzielski, Meghan Schuldt, Ravi Rastogi, Kyle Serniak, Steven J Weber, Wayne Woods, Scott Zarr, Andrew J Kerman, William D Oliver, Mollie E Schwartz, Jonilyn L Yoder A key goal of any extensible architecture for quantum information processing is to enhance connectivity and functionality while preserving qubit coherence. We describe the design and operation of high-coherence superconducting qubits in a 3D-integrated 3-tier stack that utilizes an interposer with superconducting through-silicon vias (TSVs) to connect qubits to multi-level superconducting routing while preserving qubit performance by isolating qubits from lossy dielectrics in the routing tier. Fabrication processes that produce high-coherence qubits are used on both the qubit and interposer tiers. Readout and control circuitry, including resonators and qubit control lines, are located on the interposer tier. All components are accessed using TSVs in the interposer tier and bump bonds between the tiers. |
Wednesday, March 8, 2023 12:54PM - 1:06PM |
N74.00006: Flip-Chip Packaging of Fluxonium Qubits Aaron Somoroff, Patrick Truitt, Adam Weis, Konstantin Kalashnikov, Jacob Bernhardt, Igor Vernik, Ray A Mencia, Oleg Mukhanov, Maxim G Vavilov, Vladimir E Manucharyan The strong anharmonicity and high coherence times inherent to fluxonium superconducting circuits are desirable for implementing quantum information processors [1]. To date, coherence times in excess of 1 ms and both single- and two-qubit gate fidelities above 99.99% and 99%, respectively, have been demonstrated with fluxonium qubits [2,3]. In this talk, we report novel work on fluxoniums embedded in a multi-chip module (MCM), implementing a 2.5D architecture, where a classical control and readout chip is bump-bonded to the quantum chip. We show that this configuration does not degrade the fluxonium qubit performance, paving the way for scaling fluxonium-based quantum processors. |
Wednesday, March 8, 2023 1:06PM - 1:18PM |
N74.00007: Microwave multi-planar package design for superconducting qudit chips with integrated support elements Ananyo Banerjee, Murat C Sarihan, Jin Ho Kang, Kangdi Yu, Madeline K Taylor, Cody S Fan, Chee Wei Wong Superconducting qubits have recently demonstrated quantum supremacy in noisy-intermediate scale processors for practical and scalable quantum information processing. These multi-qubit and multi-dimensional subsystems in planar wafer-scale configurations require innovative solutions in the dense multi-channel drive and readout across many physical and logical superconducting circuits. Unlike conventional microwave packaging for the operational range of 4GHz to 8 GHz, additional challenges with planar dense high-dimensional qudits emerge with maintaining high-fidelity of signals, suppression of spurious modes and crosstalk over closely-spaced frequency channels, and proper thermal control of the qubits and circuits at dilution fridge temperatures of ≈15 mK. |
Wednesday, March 8, 2023 1:18PM - 1:30PM |
N74.00008: Indium Electroplating for Scalable Integration of Superconducting Qubits Máté Jenei, Hasnain Ahmad, Mario Palma, Lan-Hsuan Lee, Wei Liu, Chun Fai Chan, Jakub Mrozek, Alpo Välimaa, Francesca Tosco, Janne Kotilahti, Alessandro Landra, Pavel Smirnov, Tianyi Li, Johannes Heinsoo, Caspar Ockeloen-Korppi, Juha Hassel, Kuan Y Tan Quantum computing to be fault tolerant it is necessary to reach the number of qubits to at least thousands. To this end, it is important to develop low-loss interconnects between the different components of the quantum processor. We report high qubit coherence made with flip-chip bonded electroplated indium bumps. The employed metal stack, bump and seed layer, performs electrically as good as the thermally-evaporated indium bumps in cryogenic environment [1]. In addition, the fabrication process is compatible with Josephson junction manufacturing keeping the average coherence time T1 ∼ 50µs. Electroplating technology allows growing bumps as tall as 20 µm which reduces crosstalk and increases freedom in design choices allowing for example stronger coupling between elements by reducing stray coupling to the opposite chiplet. |
Wednesday, March 8, 2023 1:30PM - 1:42PM |
N74.00009: CMOS On-chip Thermometry at Deep-Cryogenic Temperatures M Fernando Gonzalez-Zalba, Grayson M Noah, Thomas Swift, Mathieu de Kruijf, Alberto Gomez Saiz, M Fernando Gonzalez-Zalba, John Morton Accurate on-chip temperature sensing is critical for the characterization and optimization of modern CMOS integrated circuits, as nanometer-scale thin-body technologies such as SOI and FinFETs are susceptible to localized heating due to on-chip power dissipation. The reduced thermal conductivity of silicon at low temperatures exacerbates this localized heating for circuits operating at deep-cryogenic temperatures used in applications such as quantum computing. Deep-cryogenic on-chip thermometry is therefore an essential part of thermal management in quantum computing ICs. |
Wednesday, March 8, 2023 1:42PM - 1:54PM |
N74.00010: Circle fit optimization for resonator quality factor measurements Paul G Baity, Connor Maclean, Valentino Seferai, Joe Bronstein, Tania Hemakumara, Yi Shu, Harm Knoops, Russ Renzas, Martin P Weides The mitigation of material losses is playing an increasingly important role for improving coherence times of superconducting quantum devices [1,2]. Such material losses can be characterized through the measurement of planar superconducting resonators, which reflect losses through the resonance’s quality factor Ql. The resonance quality factor consists of both internal (material) losses as well as external losses when resonance photons escape into the measurement circuit. The combined losses are then described as Ql-1 = Qc-1 + Qi-1, where Qc and Qi reflect the external and internal quality factors of the resonator, respectively. The resonance response projects onto the complex plane as circle, which can be fit by geometric or algebraic means [3,4] to extract the resonator’s quality factors. Diameter-correcting circle fits, such as those developed by Probst et al. [5], use algebraic means to distinguish the internal and external quality factor contributions. However, such circle fits can produce varied results [6]. To address this issue, we have used a combination of simulation and experiment to determine the reliability of the fitting algorithm of Probst et al. across a wide range of quality factor values from Qici depends on the ratio Qi/Qc, Qi fits can still be accurate and reliable when noise levels are low and the number of data points remains large. In addition, we have also explored sources of fit bias and have developed alternative measurement protocols to minimize the effects of such bias from the measurement background on resonance circle fit parameters. |
Wednesday, March 8, 2023 1:54PM - 2:06PM |
N74.00011: Characterisation of a modular 3D-integrated superconducting circuit Giulio Campanaro, Shuxiang Cao, Simone D Fasciati, James F Wills, Mustafa S Bakr, Vivek Chidambaram, Boris Shteynas, Peter J Leek We present experimental results on an eight-qubit superconducting circuit comprised of fixed-frequency transmon qubits fabricated on two separate substrates and coupled together in a 1D ring topology. The device design is based on coaxial qubits with 3D-integrated readout and control [1,2] with inter-chip couplings realized capacitively between the two stacked chips. The two chips are kept separated and aligned using the sample holder in an entirely reversible assembly process requiring no additional fabrication compared to a monolithic device. We characterize the inter- and intra-chip couplings showing good agreement with electromagnetic simulation and measure crosstalk and single-qubit gate performance on par with planar monolithic devices, demonstrating the potential to build large-scale circuits based on this 3D-integrated modular approach. |
Wednesday, March 8, 2023 2:06PM - 2:18PM |
N74.00012: Microwave spectroscopy of closed-loop superconducting resonators Marie E Wesson, Saulius Vaitiekenas, Nicholas R Poniatowski, Uri Vool, Charlotte Bøttcher, Zihan Yan, Amir Yacoby The advent of circuit quantum electrodynamics opened up a new venue spanning the fields of synthetic matter, quantum information, and quantum sensors, just to name a few. A foundational element of these applications relies on high-quality factor superconducting resonators based on the Fabry-Perot-inspired geometries. The range of accessible physics can be expanded by considering closed-loop resonator geometries with potential applications ranging from the uniform coupling of scalable qubit networks to probes sensitive to chiral materials. Here, we report on characterization of lithographically defined superconducting ring resonators and present the initial microwave spectroscopy results showing the rich phenomenology of these geometries. |
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