Bulletin of the American Physical Society
2023 APS March Meeting
Volume 68, Number 3
Las Vegas, Nevada (March 5-10)
Virtual (March 20-22); Time Zone: Pacific Time
Session N74: Superconducting and Semiconductor Qubits I/O, Packaging, and 3D Integration I
11:30 AM–2:18 PM,
Wednesday, March 8, 2023
Room: Room 403/404
Sponsoring
Unit:
DQI
Chair: Joseph Glick, IBM TJ Watson Research Center
Abstract: N74.00007 : Microwave multi-planar package design for superconducting qudit chips with integrated support elements
1:06 PM–1:18 PM
Presenter:
Ananyo Banerjee
(University of California Los Angeles)
Authors:
Ananyo Banerjee
(University of California Los Angeles)
Murat C Sarihan
(University of California, Los Angeles)
Jin Ho Kang
(UCLA)
Kangdi Yu
(University of California, Los Angeles)
Madeline K Taylor
(University of California, Los Angeles)
Cody S Fan
(University of California, Los Angeles)
Chee Wei Wong
(University of California, Los Angeles)
Here we focus on the development of a microwave package from material and geometric choices to designing the resonant cavity and multi-layer interposer to provide an accommodating environment for planar qudit circuits – with high-fidelity control and readout signals while suppressing chip, cavity and interposer-based noisy modes up to 10 GHz while also reducing inter-channel crosstalk in the package. The final segments provide general guidelines to scale the presented microwave package for higher qudit systems.
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