Bulletin of the American Physical Society
2023 APS March Meeting
Volume 68, Number 3
Las Vegas, Nevada (March 5-10)
Virtual (March 20-22); Time Zone: Pacific Time
Session N74: Superconducting and Semiconductor Qubits I/O, Packaging, and 3D Integration I
11:30 AM–2:18 PM,
Wednesday, March 8, 2023
Room: Room 403/404
Sponsoring
Unit:
DQI
Chair: Joseph Glick, IBM TJ Watson Research Center
Abstract: N74.00002 : Measurements of superconducting qubits containing through-silicon vias*
12:06 PM–12:18 PM
Presenter:
Thomas M Hazard
(MIT Lincoln Lab)
Authors:
Thomas M Hazard
(MIT Lincoln Lab)
Wayne Woods
(MIT Lincoln Lab)
Rabindra Das
(MIT Lincoln Lab)
David K Kim
(MIT Lincoln Lab)
Jeffrey Knecht
(MIT Lincoln Lab)
Justin L Mallek
(MIT Lincoln Lab)
Bethany M Niedzielski
(MIT Lincoln Lab)
Donna-Ruth W Yost
(MIT - Lincoln Laboratory)
William D Oliver
(Massachusetts Institute of Technology MIT)
Jonilyn L Yoder
(MIT Lincoln Lab)
Mollie E Schwartz
(MIT Lincoln Laboratory)
*This material is based upon work supported by the U.S. Department of Energy, Office of Science, Office of Advanced Scientific Computing Research, High Performance Computing and Network Facilities (Rep - Quantum Testbeds), under contract number: FWP #FP00008338, and by the Under Secretary of Defense for Research and Engineering under Air Force Contract No. FA8702-15-D-0001. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the Department of Energy or the Under Secretary of Defense for Research and Engineering.
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