High-density I/O for next-generation quantum annealing: Part 2—Device packaging*

As superconducting quantum processors continue to scale up in size, it becomes increasingly challenging to route the required number of control lines through a dilution refrigerator to the qubit chip. In this presentation, we will discuss our efforts to develop high-density packaging for use in next-generation quantum annealers. Our packaging solutions integrate with our low crosstalk flexible multi-channel cables, and are designed to maintain isolation and moderate bandwidth. We will describe the design and electrical performance of the packages.