Bulletin of the American Physical Society
APS March Meeting 2021
Volume 66, Number 1
Monday–Friday, March 15–19, 2021; Virtual; Time Zone: Central Daylight Time, USA
Session M30: I/O, Packaging, and 3D Integration for Superconducting and Semiconductor Qubits II
11:30 AM–2:18 PM,
Wednesday, March 17, 2021
Sponsoring
Unit:
DQI
Chair: Zachary Keane, Northrop Grumman - Mission Systems
Abstract: M30.00008 : High-density I/O for next-generation quantum annealing: Part 1—Cryogenic wiring*
12:54 PM–1:06 PM
Live
Presenter:
Steven Weber
(MIT Lincoln Lab)
Authors:
Steven Weber
(MIT Lincoln Lab)
John Cummings
(MIT Lincoln Lab)
Jovi Miloshi
(MIT Lincoln Lab)
Kyle J Thompson
(MIT Lincoln Lab)
John Rokosz
(MIT Lincoln Lab)
David Holtman
(MIT Lincoln Lab)
David Conway
(MIT Lincoln Lab)
Andrew James Kerman
(MIT Lincoln Lab)
William Oliver
(MIT Lincoln Lab)
*This research was funded in part by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) and the Defense Advanced Research Projects Agency (DARPA) under Air Force Contract No. FA8702-15-D-0001. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of the ODNI, IARPA, DARPA, or the U.S. Government.
Follow Us |
Engage
Become an APS Member |
My APS
Renew Membership |
Information for |
About APSThe American Physical Society (APS) is a non-profit membership organization working to advance the knowledge of physics. |
© 2024 American Physical Society
| All rights reserved | Terms of Use
| Contact Us
Headquarters
1 Physics Ellipse, College Park, MD 20740-3844
(301) 209-3200
Editorial Office
100 Motor Pkwy, Suite 110, Hauppauge, NY 11788
(631) 591-4000
Office of Public Affairs
529 14th St NW, Suite 1050, Washington, D.C. 20045-2001
(202) 662-8700