Bulletin of the American Physical Society
APS March Meeting 2020
Volume 65, Number 1
Monday–Friday, March 2–6, 2020; Denver, Colorado
Session G28: Infrared Sensing and ImagingIndustry Invited Session
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Sponsoring Units: FIAP GIMS Chair: Carola Emminger, New Mexico State Univ Room: 405-407 |
Tuesday, March 3, 2020 11:15AM - 11:51AM |
G28.00001: Mid-IR GeSn alloys with narrow band gaps beyond 8 μm Invited Speaker: Jose Menendez GeSn alloys with dilute Sn concentrations around the near-infrared indirect to direct transition have been thoroughly investigated in recent years. However, the GeSn alloy system, in much the same way as the HgCdTe alloy, is expected to have a continuum of band gaps that reach a value of zero. Covering this IR spectral range requires much higher Sn concentrations, which are not obviously attainable given the thermodynamic metastability of the Ge-Sn system. Sporadic reports of such alloys have appeared in the literature, but in most cases the samples were unsuitable for band gap determinations. |
Tuesday, March 3, 2020 11:51AM - 12:27PM |
G28.00002: Antimonides T2SLS Infrared Focal Plane Arrays for Space Remote Sensing Applications Invited Speaker: Sarath Gunapala Ga-free type-II strained layer superlattice (T2SLS) mid-wave infrared (MWIR) and long-wave infrared (LWIR) barrier infrared detector (BIRD) such as nBn and xBn focal plane arrays (FPAs) could easily operate at higher operating temperature (i.e. compared to InSb and quantum well infrared photodetectors (QWIP) and FPAs) due to the strong suppression of G-R dark current due to SRH processes as explained earlier. We have successfully fabricated MWIR HOT-BIRD FPA and integrated with a dewar cooler assembly for the CubeSat Infrared Atmospheric Sounder (CIRAS) 6U CubeSat. We have also successfully fabricated LWIR BIRD FPA for the Hyperspectral Thermal Imager (HyTI) 6U CubeSat and it will be integrated with a dewar cooler assembly as well. These antimonides based T2SLS BIRDs outperform existing thermal infrared detectors such as QWIPs and InSb. Another 20-30K higher operating temperature advantage can be achieved when we further improve the performance by hybridizing the T2SLS LWIR BIRD detector array to the high-dynamic range in-pixel digital ROICs. Based on III-V compound semiconductors, the T2SL BIRDs offer a breakthrough solution for the realization of low cost (high yield), highperformance FPAs with excellent uniformity and pixel-to-pixel operability. Therefore, T2SLS MWIR and LWIR BIRD FPA technology is very attractive to Earth and planetary remote sensing instruments. |
Tuesday, March 3, 2020 12:27PM - 1:03PM |
G28.00003: Low-cost infrared imaging technology development at the Air Force Research Laboratory Invited Speaker: Arnold Kiefer Infrared imaging technology has numerous commercial, military, and scientific applications. As performance requirements increase, so do the costs of fabricating and operating infrared imaging systems. While many high-performance applications can be met using the very well-developed mercury cadmium telluride material system, the overall manufacturing and operational costs of the imaging system as a whole can be prohibitively expensive. The Air Force Research Laboratory (AFRL) is actively exploring various technologies using different materials and device physics to achieve adequate performance for the given application at significantly lower costs. A sample of different technologies will be reviewed with an emphasis on fundamental science and basic research needs. |
Tuesday, March 3, 2020 1:03PM - 1:39PM |
G28.00004: Photonics for Mobile Handset through Automotive 3D Sensing Consumer Applications Invited Speaker: Brandon Collings Machine learning and predictive algorithms are increasingly providing new opportunities for technology to directly participate in our interaction with the physical world around us. A crucial element of this interaction is the detailed digital characterization of that physical environment as an input to these algorithms. While digital visible light cameras have advanced dramatically, optical sensor systems able to add accurate depth measurements to 2D images within practical consumer environments are being developed to enable new consumer applications. Primary examples of these sensor driven applications include biometric authentication on mobile phone handsets and LIDAR scene mapping for autonomous vehicles. This presentation will provide an overview of the architectures of these 3D sensor systems, their underlying enabling photonic technologies, including VCSEL arrays, narrow linewidth semiconductor lasers, MEMS and optomechanical packaging, and how such complex technological solutions are being successfully brought to the consumer market. |
Tuesday, March 3, 2020 1:39PM - 2:15PM |
G28.00005: Mid-Wave Infrared Resonant Cavity Detectors Invited Speaker: Gary W Wicks The dominant issue confronted by designers and users of mid-wave infrared (MWIR) detectors is |
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