Bulletin of the American Physical Society
APS March Meeting 2018
Volume 63, Number 1
Monday–Friday, March 5–9, 2018; Los Angeles, California
Session R33: Superconducting Circuits: Design and Packaging
8:00 AM–11:00 AM,
Thursday, March 8, 2018
LACC
Room: 408B
Sponsoring
Unit:
DQI
Chair: Matteo Mariantoni, University of Waterloo
Abstract ID: BAPS.2018.MAR.R33.6
Abstract: R33.00006 : Superconducting solder bumping technology for scalable quantum annealing machines*
9:24 AM–9:36 AM
Presenter:
Kazumasa Makise
(National Institute of Advanced Industrial Science and Technology (AIST))
Authors:
Kazumasa Makise
(National Institute of Advanced Industrial Science and Technology (AIST))
Masaaki Maezawa
(National Institute of Advanced Industrial Science and Technology (AIST))
Mutsuo Hidaka
(National Institute of Advanced Industrial Science and Technology (AIST))
Hiroshi Nakagawa
(National Institute of Advanced Industrial Science and Technology (AIST))
Katsuya Kikuchi
(National Institute of Advanced Industrial Science and Technology (AIST))
*This presentation is based on results obtained from a project commissioned by the New Energy and Industrial Technology Development Organization (NEDO).
To cite this abstract, use the following reference: http://meetings.aps.org/link/BAPS.2018.MAR.R33.6
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