Superconducting Through Silicon Vias (TSVs) for 3D Integration in Quantum Computing*

Three dimensional integration is an enabling technology for quantum computing. As we progress toward many-qubit systems which require rapidly increasing circuit connectivity one approach is to route qubit control and readout through an interposer layer containing superconducting TSVs. We report on the fabrication of high aspect ratio (>10:1) superconducting TSVs and discuss electrical and reliability data on single vias and long via chains.