Superconducting qubits containing through-silicon vias*

Superconducting qubits are a promising candidate for quantum computing applications. As the number of qubits in small quantum processors increases, the relatively large size of each qubit creates new engineering challenges. Small form factor superconducting through-silicon vias (TSVs) -- originally developed for high density input/output capabilities – can be incorporated into a qubit circuit in order to reduce the qubit's size. We discuss the design, fabrication, and performance of qubits that leverage the large capacitance density of our compact TSVs.