Bulletin of the American Physical Society
APS March Meeting 2021
Volume 66, Number 1
Monday–Friday, March 15–19, 2021; Virtual; Time Zone: Central Daylight Time, USA
Session C30: I/O, Packaging, and 3D Integration for Superconducting and Semiconductor Qubits I
3:00 PM–6:00 PM,
Monday, March 15, 2021
Sponsoring
Unit:
DQI
Chair: Anthony Przybysz, Northrop Grumman
Abstract: C30.00010 : Design and Characterization of Microwave Packages for Superconducting Qubits*
5:12 PM–5:24 PM
Live
Presenter:
Sihao Huang
(Department of Physics, Massachusetts Institute of Technology)
Authors:
Sihao Huang
(Department of Physics, Massachusetts Institute of Technology)
Benjamin Lienhard
(Department of Electrical Engineering & Computer Science, Research Laboratory of Electronics, Massachusetts Institute of Technology)
Greg Calusine
(MIT Lincoln Laboratory)
Antti Vepsäläinen
(Department of Electrical Engineering & Computer Science, Massachusetts Institute of Technology)
Jochen Braumueller
(Research Laboratory of Electronics, Massachusetts Institute of Technology)
David K Kim
(MIT Lincoln Laboratory)
Joel I-Jan Wang
(Research Laboratory of Electronics, Massachusetts Institute of Technology)
Alexander Melville
(MIT Lincoln Laboratory)
Bethany Niedzielski
(MIT Lincoln Laboratory)
Jonilyn Yoder
(MIT Lincoln Laboratory)
Bharath Kannan
(Department of Electrical Engineering & Computer Science, Massachusetts Institute of Technology)
Terry Philip Orlando
(Department of Electrical Engineering & Computer Science, Research Laboratory of Electronics, Massachusetts Institute of Technology)
Simon Gustavsson
(Research Laboratory of Electronics, Massachusetts Institute of Technology)
William Oliver
(Department of Physics, Department of Electrical Engineering & Computer Science, Research Laboratory of Electronics, MIT Lincoln Laboratory, Massachusetts Institute of Technol)
*This research was funded in part by the U.S. Army Research Office (ARO) Multidisciplinary University Research Initiative (MURI) W911NF-18-1-0411, and by the Department of Defense via Lincoln Laboratory under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements of the US Government.
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