Bulletin of the American Physical Society
APS March Meeting 2021
Volume 66, Number 1
Monday–Friday, March 15–19, 2021; Virtual; Time Zone: Central Daylight Time, USA
Session C30: I/O, Packaging, and 3D Integration for Superconducting and Semiconductor Qubits I
3:00 PM–6:00 PM,
Monday, March 15, 2021
Sponsoring
Unit:
DQI
Chair: Anthony Przybysz, Northrop Grumman
Abstract: C30.00001 : 3D-integrated 25-qubit quantum annealing processor with high coherence, individualized control, and modular architecture. Part 1: design.*
3:00 PM–3:12 PM
Live
Presenter:
Sergey Novikov
(Northrop Grumman - Mission Systems)
Authors:
Sergey Novikov
(Northrop Grumman - Mission Systems)
Roy Murray
(Northrop Grumman - Mission Systems)
Edward M Leonard
(Northrop Grumman - Mission Systems)
Alexander Marakov
(Northrop Grumman - Mission Systems)
Thomas Chamberlin
(Northrop Grumman - Mission Systems)
James I Basham
(Northrop Grumman - Mission Systems)
Jeffrey Grover
(Northrop Grumman - Mission Systems)
Steven M Disseler
(Northrop Grumman - Mission Systems)
Rabindra Das
(MIT Lincoln Laboratory)
David K Kim
(MIT Lincoln Laboratory)
Justin L Mallek
(MIT Lincoln Laboratory)
Bethany Niedzielski
(MIT Lincoln Laboratory)
Danna Rosenberg
(MIT Lincoln Laboratory)
Wayne Woods
(MIT Lincoln Laboratory)
Donna-Ruth Yost
(MIT Lincoln Laboratory)
Jonilyn Yoder
(MIT Lincoln Laboratory)
William Oliver
(MIT Lincoln Laboratory)
Daniel Lidar
(University of Southern California)
Kenneth Zick
(Northrop Grumman - Mission Systems)
David Ferguson
(Northrop Grumman - Mission Systems)
*The research is based upon work supported in part by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) and the Defense Advanced Research Projects Agency (DARPA), via the U.S. Army Research Office contract W911NF-17-C-0050 and via MIT Lincoln Laboratory under Air Force Contract No. FA8721-05-C-0002.
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