Extending Superconducting Qubits Out of Plane (Part 2): Through-Silicon Vias*

Addressing complex arrays of high coherence qubits is a necessary capability for the construction of a quantum processor. To enable high connectivity of superconducting qubits we are utilizing heterogeneous 3D integration of a qubit tier, an interposer with high-aspect-ratio superconducting through-silicon vias (TSVs), and a superconducting multi-chip module. In part 2 of this talk we will focus on the fabrication of TSVs within the interposer tier and their implementation within multi-tier stacks.