Design, Modeling, and Measurement of Through-Silicon Via (TSV) Structures for Superconducting Quantum Computing*

We have integrated high-aspect ratio superconducting through silicon vias (TSVs) into routing and control circuitry for superconducting qubits, as well as for dedicated grounding of on-chip ground planes, and for the elimination of chip box modes. We describe our electromagnetic modeling of TSV-embedded routing elements, and we demonstrate their incorporation into design and measurement of superconducting qubits. We also describe the robust modeling and design methodology we use to optimize the combination of compactness, electrical reflections, and dielectric losses.