Bulletin of the American Physical Society
APS March Meeting 2019
Volume 64, Number 2
Monday–Friday, March 4–8, 2019; Boston, Massachusetts
Session X15: 2D Materials (Semiconductors) -- Synthesis, Defects, and Strain
8:00 AM–11:00 AM,
Friday, March 8, 2019
BCEC
Room: 154
Sponsoring
Units:
DMP DCOMP
Chair: Guillaume Gervais, McGill University
Abstract: X15.00004 : Role of Strain in Quantum-Confined States of Heterobilayers of 2D Materials*
8:36 AM–8:48 AM
Presenter:
Dacen Waters
(Physics, Carnegie Mellon University)
Authors:
Dacen Waters
(Physics, Carnegie Mellon University)
Felix Lukas Lüpke
(Physics, Carnegie Mellon University)
Yifan Nie
(Materials Science and Engineering, The University of Texas at Dallas)
Yi Pan
(Center for Spintronics and Quantum Systems, State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University)
Stefan Fölsch
(Paul-Drude-Institut für Festkörperelektronik)
Yu-Chuan Lin
(Dept. Materials Science and Engineering, and Center for 2-Dimensional and Layered Materials, The Pennsylvania State University)
Bhakti Jariwala
(Dept. Materials Science and Engineering, and Center for 2-Dimensional and Layered Materials, The Pennsylvania State University)
Kehao Zhang
(Dept. Materials Science and Engineering, and Center for 2-Dimensional and Layered Materials, The Pennsylvania State University)
Kyeongjae Cho
(Materials Science and Engineering, The University of Texas at Dallas)
Joshua Robinson
(Dept. Materials Science and Engineering, and Center for 2-Dimensional and Layered Materials, The Pennsylvania State University)
Randall Feenstra
(Physics, Carnegie Mellon University)
[1] Y. Pan, S. Fölsch, Y. Nie, D. Waters, Y.-C. Lin, B. Jariwala, K. Zhang, K. Cho, J. A. Robinson, and R. M. Feenstra, Nano Lett. 18, 1849 (2018).
*This work was supported in part by the A. von Humboldt Foundation and by the Center for Low-Energy Systems Technology (LEAST), one of six centers of STARnet, a Semiconductor Research Corporation program sponsored by Microelectronics Advanced Research Corporation (MARCO) and Defense Advanced Research Projects Agency (DARPA).
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