Superconducting Qubits Integrated with Superconducting Through-Substrate Vias (TSVs): Fabrication*

Three-dimensional integration (3DI) is a promising approach to provide increased connectivity for complex arrays of superconducting qubits while maintaining qubit performance. In this talk we describe our process flow for fabricating wafers of superconducting through-substrate vias (TSVs) which may be integrated directly into superconducting qubit chips and/or bump bond integrated with high-coherence qubits to carry signals to and from the qubit layer.