Intel Superconducting Qubits, Part 2: Integration on through-silicon-via (TSV) substrates.

Quantum computing holds the potential for significantly improving computing speed relative to classical computing for selected algorithms and applications. Many researchers using transmons in a circuit QED quantum hardware architecture are producing chips with ever-increasing numbers of qubits. The corresponding increase in chip size shifts the cavity/drum resonant modes into a frequency range where qubits could be adversely affected. One solution is to implement through-silicon-vias (TSVs) and chip/cavity contact pins to supply more ground connections. We present recent microwave modeling and fabrication results on qubit chips containing membrane-covered TSVs. These flip chips are assembled using a ball-grid-array die-package interface for signal I/O.