Bulletin of the American Physical Society
APS March Meeting 2019
Volume 64, Number 2
Monday–Friday, March 4–8, 2019; Boston, Massachusetts
Session S21: Nanostructures and Metamaterials -- Functional Systems
11:15 AM–2:15 PM,
Thursday, March 7, 2019
BCEC
Room: 157B
Sponsoring
Unit:
DMP
Chair: Pankaj Jha, Caltech
Abstract: S21.00014 : Wafer-scale photolithography of ultra-sensitive nanocantilever force sensors*
1:51 PM–2:03 PM
Presenter:
Ying Pan
(Harvard University)
Authors:
Ying Pan
(Harvard University)
Calder Miller
(Harvard University)
Kai Trepka
(Harvard University)
Ye Tao
(Harvard University)
Here, we develop a robust method to batch fabricate extreme-aspect-ratio (10^3), singly-clamped scanningnanowire mechanical resonators from plain bulk silicon wafers using standard photolithography. We discuss the superior performance and additional versatility of the approach beyond what can be achieved using the established silicon-on-oxide (SOI) technology.
*Y. P. acknowledges funding from a Rowland Postdoctoral Fellowship. C. M. and K. T. acknowledge support from the Harvard Physics Department, the Harvard Office of Undergraduate Research and Fellowships, and the Rowland Institute. This work was supported by a Rowland Fellowship to Y. T.. The sample fabrication was carried out at the Center for Nanoscale Systems (CNS) at Harvard University.
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