Scaling up package I/O for superconducting qubits*

Device packages, which house qubit chips and make connections to control and readout wiring, are an essential component of any superconducting qubit architecture. In this presentation, we discuss our efforts to design packages with an increasing number of signal connections, for applications in quantum annealing and gate-based quantum computing. We present strategies for achieving high-density wiring while avoiding package modes and reducing crosstalk. We characterize package performance using electromagnetic simulations, room-temperature measurements, and cryogenic qubit measurements.