Bulletin of the American Physical Society
APS March Meeting 2018
Volume 63, Number 1
Monday–Friday, March 5–9, 2018; Los Angeles, California
Session X37: Devices from 2D Materials VII - Scalable devices
8:00 AM–11:00 AM,
Friday, March 9, 2018
LACC
Room: 411
Sponsoring
Unit:
DMP
Chair: Mahesh Neupane, Army Research Lab
Abstract ID: BAPS.2018.MAR.X37.4
Abstract: X37.00004 : Building Flexible, Microscopic Sensor Nodes with 2D Materials*
8:36 AM–8:48 AM
Presenter:
Marek Hempel
(Electrical Engineering and Computer Science, Massachusetts Institute of Technology)
Authors:
Marek Hempel
(Electrical Engineering and Computer Science, Massachusetts Institute of Technology)
Elaine McVay
(Electrical Engineering and Computer Science, Massachusetts Institute of Technology)
Jing Kong
(Electrical Engineering and Computer Science, Massachusetts Institute of Technology)
Tomas Palacios
(Electrical Engineering and Computer Science, Massachusetts Institute of Technology)
*This work is supported by the AFOSR MURI-FATE program, Grant No. FA9550-15-1-0514.
To cite this abstract, use the following reference: http://meetings.aps.org/link/BAPS.2018.MAR.X37.4
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