Bulletin of the American Physical Society
APS March Meeting 2017
Volume 62, Number 4
Monday–Friday, March 13–17, 2017; New Orleans, Louisiana
Session Index
Session H46: 3D Integration and Packaging of Superconducting Qubits |
Show Abstracts |
Sponsoring Units: GQI Chair: John Martinis, Google and University of California Room: 393 |
Tuesday, March 14, 2017 2:30PM - 2:42PM |
H46.00001: 3D Integration for Superconducting Qubits Danna Rosenberg, David Kim, Donna-Ruth Yost, Justin Mallek, Jonilyn Yoder, Rabindra Das, Livia Racz, David Hover, Steven Weber, Andrew Kerman, William Oliver Preview Abstract | |
Tuesday, March 14, 2017 2:42PM - 2:54PM |
H46.00002: Silicon Hard-Stop Mesas for 3D Integration of Superconducting Qubits David Kim, Danna Rosenberg, Brenda Osadchy, Greg Calusine, Rabindra Das, Alexander Melville, Jonilyn Yoder, Donna-Ruth Yost, Livia Racz, William Oliver Preview Abstract | |
Tuesday, March 14, 2017 2:54PM - 3:06PM |
H46.00003: Bridging the Gap for High-Coherence, Strongly Coupled Superconducting Qubits Jonilyn Yoder, David Kim, Peter Baldo, Alexandra Day, George Fitch, Eric Holihan, David Hover, Gabriel Samach, Steven Weber, William Oliver Preview Abstract | |
Tuesday, March 14, 2017 3:06PM - 3:18PM |
H46.00004: Airbridges for scalable microwave control of superconducting qubits Michael T. Fang, Andrew J. Keller, Oskar J. Painter Preview Abstract | |
Tuesday, March 14, 2017 3:18PM - 3:30PM |
H46.00005: Engineering scalable fault-tolerant quantum computation Mollie Kimchi-Schwartz, Rosenberg Danna, David Kim, Jonilyn Yoder, Morten Kjaergaard, Rabindra Das, Jeff Grover, Simon Gustavsson, William Oliver Preview Abstract | |
Tuesday, March 14, 2017 3:30PM - 3:42PM |
H46.00006: 3D integration of superconducting qubits with bump bonds: Part 1 J. Mutus, B. Foxen, E. Lucero, J. Kelly, Y. Yang, A. Yu, M. Baldwinson, Z. Chen, B. Chiaro, A. Dunsworth, C. Neill, C. Quintana, J. Wenner, John. M. Martinis Preview Abstract | |
Tuesday, March 14, 2017 3:42PM - 3:54PM |
H46.00007: 3D integration of superconducting qubits with bump bonds: Part 2 Julian Kelly, J. Mutus, E. Lucero, B. Foxen, R. Graff, P. Klimov, Z. Chen, B. Chiaro, A. Dunsworth, C. Neill, C. Quintana, J. Wenner, John. M. Martinis Preview Abstract | |
Tuesday, March 14, 2017 3:54PM - 4:06PM |
H46.00008: 3D integration of superconducting qubits with bump bonds: Part 3 Erik Lucero, E. Jeffrey, A. Vainsencher, P. Klimov, T. Huang, Z. Chen, B. Chiaro, A. Dunsworth, B. Foxen, C. Neill, C. Quintana, J. Wenner, John. M. Martinis Preview Abstract | |
Tuesday, March 14, 2017 4:06PM - 4:18PM |
H46.00009: Quantum Devices Bonded Beneath a Superconducting Shield: Part 1 C.T. Earnest, C.R. McRae, A.O. Abdallah, J.H. B{\'e}janin, T.G. McConkey, Z. Pagel, M. Mariantoni Preview Abstract | |
Tuesday, March 14, 2017 4:18PM - 4:30PM |
H46.00010: Quantum Devices Bonded Beneath a Superconducting Shield: Part 2 Corey Rae McRae, Adel Abdallah, Jeremy Bejanin, Carolyn Earnest, Thomas McConkey, Zachary Pagel, Matteo Mariantoni Preview Abstract | |
Tuesday, March 14, 2017 4:30PM - 4:42PM |
H46.00011: Control and Measurement of an Xmon with the Quantum Socket T.G. McConkey, J.H. Bejanin, C.T. Earnest, C.R.H. McRae, J.R. Rinehart, M. Weides, M. Mariantoni Preview Abstract | |
Tuesday, March 14, 2017 4:42PM - 4:54PM |
H46.00012: Design and Implementation of Multi-Qubit 3D Quantum Integrated Circuits Andrew Bestwick, Alexander Papageorge, Matt Reagor, Chad Rigetti Preview Abstract | |
Tuesday, March 14, 2017 4:54PM - 5:06PM |
H46.00013: High Coherence Qubit packaging David P. Pappas, Xian Wu, Salvatore B. Olivadese, V. P. Adiga, Jared B. Hertzberg, Nicholas T. Bronn, Jerry M. Chow Preview Abstract | |
Tuesday, March 14, 2017 5:06PM - 5:18PM |
H46.00014: Micromachined integrated quantum circuit containing a superconducting qubit Teresa Brecht, Yiwen Chu, Christopher Axline, Wolfgang Pfaff, Jacob Blumoff, Kevin Chou, Lev Krayzman, Luigi Frunzio, Robert Schoelkopf Preview Abstract |
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