Bulletin of the American Physical Society
APS March Meeting 2015
Volume 60, Number 1
Monday–Friday, March 2–6, 2015; San Antonio, Texas
Session S19: Invited Session: Additive Manufacturing: The Promises and Risks |
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Sponsoring Units: FPS FIAP Chair: Arian Pregenzer, Sandia National Laboratories Room: Mission Room 103B |
Thursday, March 5, 2015 8:00AM - 8:36AM |
S19.00001: Historical Overview of 3-D Printing: Do inventors know what they are doing? Invited Speaker: Michael Cima |
Thursday, March 5, 2015 8:36AM - 9:12AM |
S19.00002: Functional Structures for System Integrity and Security Invited Speaker: David M. Keicher The 3D printing revolution is redefining manufacturing and has given rise to a new industry segment called Additive Manufacturing (AM). Assemblies of mechanical components can now be integrated into a single printed structure. A logical next phase in this revolution is to assimilate multiple technologies to functionalize these 3D printed structures. Some applications include embedding of simple sensors for structural health monitoring and tamper protection to fully integrating electronics onto nontraditional surfaces such as the inside shell of a housing. Electronic printing technologies provide an enabling tool to this end. This talk will describe work in printing large area sensors for temperature, strain and proximity detection applications. A critical aspect will also cover improvements made to aerosol based printing technologies to provide a more robust printing solution that both demonstrates improved printing performance over existing technologies and lowers the barrier to entry for high precision conformal printing of electronics.\\[4pt] Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy's National Nuclear Security Administration under contract DE-AC04-94AL85000. [Preview Abstract] |
Thursday, March 5, 2015 9:12AM - 9:48AM |
S19.00003: Industrialization of Additive Manufacturing: Challenges and Opportunities Invited Speaker: Prabjhot Singh |
Thursday, March 5, 2015 9:48AM - 10:24AM |
S19.00004: Additive Manufacturing and High-Performance Computing: a Disruptive Latent Technology Invited Speaker: Bruce Goodwin This presentation will discuss the relationship between recent advances in Additive Manufacturing (AM) technology, High-Performance Computing (HPC) simulation and design capabilities, and related advances in Uncertainty Quantification (UQ), and then examines their impacts upon national and international security. The presentation surveys how AM accelerates the fabrication process, while HPC combined with UQ provides a fast track for the engineering design cycle. The combination of AM and HPC/UQ almost eliminates the engineering design and prototype iterative cycle, thereby dramatically reducing cost of production and time-to-market. These methods thereby present significant benefits for US national interests, both civilian and military, in an age of austerity. Finally, considering cyber security issues and the advent of the ``cloud,'' these disruptive, currently latent technologies may well enable proliferation and so challenge both nuclear and non-nuclear aspects of international security. [Preview Abstract] |
Thursday, March 5, 2015 10:24AM - 11:00AM |
S19.00005: Additive Manufacturing and Medical Devices: Case studies, Technical Concerns and Research Invited Speaker: Katherine Vorvolakos The past decade has seen a steady increase in the marketing of medical devices produced via additive manufacturing (AM). This presentation discusses the technical concerns surrounding AM in the context of medical devices. While unprecedented complexity is possible, maintaining safety and effectiveness requires a more nuanced understanding of the interdependent chemical, physical, software and process traits of creating an AM medical device. This presentation will feature historical perspective, cite specific technical concerns and describe a few medical device case studies. Additionally, it will highlight FDA research and an upcoming FDA guidance document, both of which aim to identify and help address these technical concerns. [Preview Abstract] |
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