Overcoming Challenges in Semiconductor Manufacturing: Bridging Engineering and Science

The semiconductor industry indeed faces increasingly complex challenges due to the smaller size and intricate structures of semiconductor devices. These challenges extend beyond mere engineering concerns and require a shift from an engineering-centric to a scientific approach to effectively address them. As a result, manufacturing semiconductors has become more difficult and requires a significant amount of time and resources. This talk will explore the multifaceted nature of these challenges, such as process intricacies, integration issues, and the impact of pre- and post-process outcomes and discuss collaborative efforts to overcome them. Collaborations among academia, industry, and research institutions are important to address these challenges effectively and achieve breakthroughs. Interdisciplinary collaboration, involving experts from various fields, enables a holistic approach to solving scientific problems associated with manufacturing processes. Embracing this transition from engineering-centric to scientific approach and promoting interdisciplinary collaboration are essential for ongoing research and development to overcome challenges and drive innovation in semiconductor manufacturing. It's also crucial to recognize the importance of addressing these challenges, not only for the present but also for a promising future of the semiconductor industry.