Bulletin of the American Physical Society
76th Annual Gaseous Electronics Conference
Volume 68, Number 9
Monday–Friday, October 9–13, 2023; Michigan League, Ann Arbor, Michigan
Session FM1: Opportunities for Plasma Science and Engineering in Microelectronics Fabrication
10:00 AM–5:30 PM,
Monday, October 9, 2023
Room: Michigan League, Michigan
Chair: Mark Kushner, University of Michigan; Steven Shannon, North Carolina State University
Abstract: FM1.00010 : Profile Simulation for Advanced Semiconductor Fabrication: Challenges and Opportunities from the Etch Perspective
3:30 PM–4:05 PM
Presenter:
Du Zhang
(TEL Technology Center, America, LLC)
Authors:
Du Zhang
(TEL Technology Center, America, LLC)
Toru Hisamatsu
(TEL Technology Center, America, LLC)
Akiteru Ko
(TEL Technology Center, America, LLC)
Peter Biolsi
(TEL Technology Center, America, LLC)
In this talk, we will first examine the key issues in basic plasma etch processes regarding etch rate control and feature profile control. Second, we will review the existing methodologies of profile simulation in terms of fundamental principles as well as pros and cons. Third, we will demonstrate the application of profile simulations with concrete examples. Finally, we will provide the outlook on potential future development directions in profile simulation technologies (physics and chemistry complexity, computational speed, synergy with other M&S modules, etc.) based on existing industrial needs.
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