CMS Forward Pixels Assembly and Quality Control*

The CMS pixel detector at the LHC will consist of two barrel layers and two end disks in the forward and backward direction. The end disks contain $\sim$800 silicon detector modules called plaquettes for a total of $\sim$18 million 100 $\times$ 150 $\mu$m pixels. Each plaquette is composed of a silicon sensor bump-bonded to custom-made readout electronics mounted on a high density interconnect. We present the automated procedures developed for assembly quality control which are sensitive to missing bump-bonds. We also discuss the module performance optimization, such as the threshold equalization among all pixels on a chip, which is necessary for physics data taking.