Bulletin of the American Physical Society
2023 Annual Meeting of the APS Mid-Atlantic Section
Friday–Sunday, November 3–5, 2023; University of Delaware, Newark, Delaware
Session C04: Applied Physics
9:00 AM–10:36 AM,
Saturday, November 4, 2023
University of Delaware
Room: Gore 102
Chair: Ali Kefayati, State Univ of NY - Buffalo
Abstract: C04.00004 : ErAs:InGaAlBiAs performance as a detector of THz pulses*
10:00 AM–10:12 AM
Presenter:
Wilder Acuna
(University of Delaware)
Authors:
Wilder Acuna
(University of Delaware)
Weipeng Wu
(University of Delaware)
James Bork
(University of Delaware)
Matthew F Doty
(University of Delaware)
M. Benjamin Jungfleisch
(University of Delaware)
Lars Gundlach
(University of Delaware)
Joshua Zide
(University of Delaware)
We present our work on the elaboration of photoconductive switches (PCS) for the detection of THz pulses and the growth of the active material (ErAs:InGaAlBiAs) by a digital alloy approach using molecular beam epitaxy technique. In this semiconductor, the incorporation of Er above the solubility limit creates ErAs nanoparticles, decreasing the material's carrier lifetime. At the same time, ErAs nanoparticles have a strong pinning effect on the effective Fermi level position. Simultaneously, InGaAlBiAs offers enough degree of freedom to tune the bandgap and band alignment to the pinned Fermi level. These samples are characterized by different techniques to know the relevant properties. Dark resistance is obtained from Hall effect and Van der Pauw measurements, carrier lifetime from optical pump THz probe spectroscopy, optical band gap from spectrophotometry, material quality from high-resolution x-ray diffraction, and composition through Rutherford backscattering spectrometry. Finally, when the material meets the desired properties, we fabricated PCSÂ to test its performance as a detector of THz pulses using 1550 nm wavelength excitation.
*This research was primarily supported by NSF through the University of Delaware Materials Research Science and Engineering Center, DMR-2011824.
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