On scaling superconducting qubits with 3D-integration modules in an advanced 300mm-fabrication environment*

Superconducting qubits have emerged as one of the prime contenders for quantum computing architectures, owing to their potential for scalability and controllability. The most advanced superconducting qubit processors to date have predominantly used lift-off techniques, especially in the fabrication of Josephson junctions and for flip-chip 3D integration. However, it's important to note that while lift-off techniques have been successful, they present compatibility challenges when integrated into standard foundry-manufacturing processes. We report on the realization of highly coherent transmon qubits without the need for shadow evaporation and lift-off, and 3D-integration modules that are promising to integrate with such qubits in a 300mm fab environment. With these demonstrators, our work paves a way towards upscaling of superconducting qubits in advanced manufacturing environments.