Bulletin of the American Physical Society
APS March Meeting 2023
Volume 68, Number 3
Las Vegas, Nevada (March 5-10)
Virtual (March 20-22); Time Zone: Pacific Time
Session T00: Poster Session III (1pm-4pm PST)
1:00 PM,
Thursday, March 9, 2023
Room: Exhibit Hall (Forum Ballroom)
Sponsoring
Unit:
APS
Abstract: T00.00105 : Measuring the phonon contributions to total thermal conductivity of Ruthenium and Tungsten thin films using a steady-state thermoreflectance technique*
Presenter:
Md Rafiqul Islam
(University of Virginia)
Authors:
Md Rafiqul Islam
(University of Virginia)
Sean W King
(Supplier, Technology, and Industry Development, Intel Corporation, Hillsboro, Oregon 97124, USA)
Kandabara Tapily
(TEL Technology Center, America, Albany NY 12203, USA)
Daniel H Hirt
(Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, USA)
John Tomko
(Univ of Virginia)
Christopher Jezewski
(Components Research, Intel Corporation, Hillsboro, Oregon 97124, USA)
Colin D Landon
(Logic Technology Development, Intel Corporation, Hillsboro, Oregon 97124, USA)
Kiumars Aryana
(NASA langly Research Center, Hampton, VA, 23666)
Colin Carver
(Components Research, Intel Corporation, Hillsboro, Oregon 97124, USA)
Patrick Hopkins
(Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, USA)
Eric R Hoglund
(Univ of Virginia)
Rinus T.P. Lee
(TEL Technology Center, America, Albany NY 12203, USA)
*We appreciate support from the Semiconductor Research Corporation (SRC). We appreciate insightful discussions from our SRC Technical Liaisons from Intel, TEL and ASM.
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