Bulletin of the American Physical Society
2023 APS March Meeting
Volume 68, Number 3
Las Vegas, Nevada (March 5-10)
Virtual (March 20-22); Time Zone: Pacific Time
Session S51: New Materials and Physics for Innovations in Telecommunications
8:00 AM–11:00 AM,
Thursday, March 9, 2023
Room: Room 321
Sponsoring
Unit:
FIAP
Chair: Nathan Orloff, National Institute of Standards and Technology
Abstract: S51.00001 : Characterizing interconnects to 325 GHz
8:00 AM–8:36 AM
Presenter:
Nicholas R Jungwirth
(National Institute of Standards and Tech)
Author:
Nicholas R Jungwirth
(National Institute of Standards and Tech)
Collaborations:
Nicholas R. Jungwirth, Bryan T. Bosworth, Aaron M. Hagerstrom, Meagan C. Papac, Eric J. Marksz, Jerome Cheron, Kassiopeia Smith, Angela C. Stelson, Ari Feldman, Dylan F. Williams, Nathan D. Orloff, Christian J. Long
In this talk I present an IC characterization procedure that works by embedding SIC into the error boxes of a TRL calibration and subsequently de-embedding SIC using a separate TRL calibration. I begin by introducing an analytical model of distributed contactless ICs. This model shows excellent agreement with full-wave simulations for the case of broadside-coupled coplanar waveguides (CPWs) separated by an SU-8 spacer layer. I then present experimental results where we embed and then de-embed broadside-coupled CPWs from a TRL calibration. We find excellent agreement between our model, simulations, and experimental results. These results validate calibration schemes that embed ICs into the calibration error boxes and provide a pathway to translate measurement reference planes beyond IC boundaries in circuit topologies where certain layers are not directly probable.
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