Bulletin of the American Physical Society
2023 APS March Meeting
Volume 68, Number 3
Las Vegas, Nevada (March 5-10)
Virtual (March 20-22); Time Zone: Pacific Time
Session Q72: Superconducting and Semiconductor Qubits: I/O, Packaging, and 3D Integration II
3:00 PM–5:24 PM,
Wednesday, March 8, 2023
Room: Room 406
Sponsoring
Unit:
DQI
Chair: Matthias Mergenthaler, IBM Research Europe - Zurich
Abstract: Q72.00007 : Temperature Performance of Magnetic Shielding for Multi-Qubit Chip Carrier
4:12 PM–4:24 PM
Presenter:
Soren Andresen
(Quantum Machines, QDevil ApS)
Authors:
Soren Andresen
(Quantum Machines, QDevil ApS)
Patrick Paluch
(IQMT and PHI, Karlsruhe Institute of Technology (KIT))
Alexander Zilz
(Qinu GmbH)
Ioan-Mihai Pop
(IQMT and PHI, Karlsruhe Institute of Technology (KIT))
Wolfgang Wernsdorfer
(IQMT and PHI, Karlsruhe Institute of Technology (KIT))
In this work we introduce a magnetic shielding for our multi-qubit chip carrier: QCage.24[3]. The shielding is a fully EMC tight assembly composed of layers of mu-metal and bulk aluminum. Since thermalization of the qubit chip is of the utmost importance to increase coherence times, we show that our solution enables cooling down below 50 mK with a minimal time delay. Optimal heat sinking to the mixing chamber plate is achieved, showing recovery times of about 15 minutes after induced heating is applied. Eventually, no heating effects were observed at the sample mount inside the shielding when inducing magnetic heating in the outer mu-metal shield.
[1] Krinner, S. et al., Nature 605, 669 (2022)
[2] Kjaergaard, M. et al., Annual Review of Condensed Matter Physics 11, 369 (2020)
[3] https://qdevil.com/qcage-microwave-cavity-sample-holder/
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