Bulletin of the American Physical Society
APS March Meeting 2023
Volume 68, Number 3
Las Vegas, Nevada (March 5-10)
Virtual (March 20-22); Time Zone: Pacific Time
Session N34: Physics and Applications in Electronic Devices
11:30 AM–2:30 PM,
Wednesday, March 8, 2023
Room: Room 226/227
Sponsoring
Unit:
FIAP
Chair: Parisa Bazazi, Princeton Univeristy
Abstract: N34.00009 : Superconducting phonon blocked thermionic coolers*
1:30 PM–1:42 PM
Presenter:
Joel Hätinen
(VTT Technical Research Centre of Finland)
Authors:
Joel Hätinen
(VTT Technical Research Centre of Finland)
Janne Lehtinen
(VTT Technical Research Centre of Finland)
Mika Prunnila
(VTT Technical Research Centre of Finland)
Emma Mykkänen
(VTT Technical Research Centre of Finland)
Antti Kemppinen
(VTT Technical Research Centre of Finland)
Klaara Viisanen
(VTT Technical Research Centre of Finland)
Lassi Lehtisyrjä
(VTT Technical Research Centre of Finland)
Alberto Ronzani
(VTT Technical Research Centre of Finland)
Collaboration:
VTT Technical Research Centre of Finland Ltd
The full temperature range is realized by cascading multiple cooler stages together by 3D integration. Each stage consists of highly transparent and low leakage semiconductor-superconductor (Sm-S) tunnel-junctions, which also provides phonon isolation and mechanical support. Optimal operation point is provided for each stage by utilizing metals of different superconducting gaps (e.g. Nb, V, Al, Ti). We have demonstrated high quality silicon-vanadium tunnel-junctions [1] and cooled a suspended silicon chip down to 40% below the bath temperature [2,3]. Recently, we have also demonstrated a high thermal resistance in 3D integrated flip-chip device which paves the way for the envisioned device [4].
*European Union’s Horizon 2020 research and innovation program under grant No 766853 EFINED, Academy of Finland project No 322580 ETHEC andAcademy of Finland Centre of Excellence program, Centre of Excellence in Quantum Technology QTF No 336817.
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