Bulletin of the American Physical Society
APS March Meeting 2023
Volume 68, Number 3
Las Vegas, Nevada (March 5-10)
Virtual (March 20-22); Time Zone: Pacific Time
Session N34: Physics and Applications in Electronic Devices
11:30 AM–2:30 PM,
Wednesday, March 8, 2023
Room: Room 226/227
Sponsoring
Unit:
FIAP
Chair: Parisa Bazazi, Princeton Univeristy
Abstract: N34.00004 : Thermomechanical Nanomolding of 2D Nanostructures*
12:30 PM–12:42 PM
Presenter:
Mehrdad T Kiani
(Cornell University)
Authors:
Mehrdad T Kiani
(Cornell University)
Quynh Sam
(Cornell University)
Hyeuk Jin Han
(Sungshin Women's university)
Yeon Sik Jung
(Korea Advanced Institute of Science & Technology)
Judy J Cha
(Cornell University)
Here, we extend TMNM to 2D nanostructures. Using 2D Si trenches with a 40 nm width and 500 nm depth as a mold, we fabricate Cu nanostructures using both Cu foil and single crystal Cu as bulk feedstock. S/TEM and SEM imaging confirm successful molding over millimeter distances with aspect ratios > 10; however, the final structures are not always single crystal and possess deformation twins, in contrast to TMNM-fabricated nanowires. We relate the differences in grain and defect structure to different boundary conditions during molding in 1D vs 2D and the role of interfacial energy between the mold and Cu in driving solid-state diffusion.
*We acknowledge support from National Science Foundation under grant #E748443
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