Bulletin of the American Physical Society
APS March Meeting 2023
Volume 68, Number 3
Las Vegas, Nevada (March 5-10)
Virtual (March 20-22); Time Zone: Pacific Time
Session G04: Beyond Linear: Structure, Dynamics, Response and Unique Properties of Topological Polymers II
11:30 AM–2:18 PM,
Tuesday, March 7, 2023
Room: Room 127
Sponsoring
Unit:
DPOLY
Chair: Ryan Poling-Skutvik, University of Rhode Island
Abstract: G04.00010 : Mesogen alignment in liquid crystal elastomer (LCE) microparticles under mechanical stress: experiments and simulations*
1:42 PM–1:54 PM
Presenter:
Chuqiao Chen
(University of Chicago)
Authors:
Chuqiao Chen
(University of Chicago)
Viviana Palacio-Betancur
(University of Chicago)
Annie Zhi
(University of Chicago)
Stuart J Rowan
(University of Chicago)
Juan J De Pablo
(University of Chicago)
In this work, we study micron-sized LCE particles that were synthesized via dispersion polymerization. The particles display unique polarized optical textures under compression, shear and uniaxial extension. The particles' aspect ratio can be programmed by stress and controlling the crosslinking density. Finally, in order to model the stress-induced alignment and the defect formation process, we adopt a tensorial representation of the local order parameter and finite element discretization to describe the evolving geometries. The director field relaxation is obtained through a Ginzburg-Landau relaxation, where the free energy functional includes contributions from nematic elasticity, strain, memory effects, and coupling between the strain and the local ordering. By combining experiments and simulations, we build a detailed understanding on how the mesogen alignment evolve under external stress thereby facilliating LCE applications at microscopic scales.
*This work was supported by NIST contract 60NANB15D077, the Center for Hierarchical Materials Design (CHiMaD) and the MRSEC graduate fellowship. Parts of this work were carried out at the Soft Matter Characterization Facility and at the Materials Research Science and Engineering Center (MRSEC NSF DMR1420709) at the University of Chicago.
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