Bulletin of the American Physical Society
APS March Meeting 2022
Volume 67, Number 3
Monday–Friday, March 14–18, 2022; Chicago
Session S13: Industrial and Applied Transmission Electron Microscopy
8:00 AM–11:00 AM,
Thursday, March 17, 2022
Room: McCormick Place W-183A
Sponsoring
Unit:
FIAP
Chair: Todd Brintlinger, United States Naval Research Laboratory
Abstract: S13.00001 : Probing atomic reconstruction at 2D interfaces via scanning transmission electron microscopy*
8:00 AM–8:36 AM
Presenter:
Pinshane Y Huang
(University of Illinois at Urbana-Champaign)
Author:
Pinshane Y Huang
(University of Illinois at Urbana-Champaign)
We also use custom-built 2D stacks to study the bending and bending-induced properties of 2D multilayers. We find that interlayer interactions play a major role in governing the bending of 2D stacks, where they lead to an unusually low bending stiffness in few-layer graphene and a curvature-dependence of the bending stiffness.[1] The key role of interfaces in the bending of 2D multilayers also indicates potential methods to tune the deformability of 2D systems though interfacial engineering [2]. Our techniques should enable the rational design of interfacial properties of devices based on 2D materials, including illustrating how to incorporate slippable interfaces and create deformable, stress-resilient electronics.
* Key contributors to this work: Edmund Han, Jaehyung Yu, Chia-Hao Lee, Yichao Zhang, Huije Ryu, Jangyup Son, M. Abir Hossain, Kenji Watanabe, Takashi Taniguchi, Gwan Hyoung Lee, Elif Ertekin, and Arend van der Zande
*We gratefully acknowledge funding support from the U.S. Department of Energy (Award Number DE-SC0020190) and the Illinois MRSEC, (NSF Award Number DMR-1720633).
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