Bulletin of the American Physical Society
APS March Meeting 2022
Volume 67, Number 3
Monday–Friday, March 14–18, 2022; Chicago
Session K39: Semiconductor Qubits V
3:00 PM–5:48 PM,
Tuesday, March 15, 2022
Room: McCormick Place W-196A
Sponsoring
Units:
DQI DCMP
Chair: Guido Burkard, Konstanz
Abstract: K39.00006 : Combining n-MOS Charge Sensing with p-MOS Silicon Hole Double Quantum Dots in a CMOS platform*
4:24 PM–4:36 PM
Presenter:
Ikkyeong Jin
(University of New South Wales)
Authors:
Ikkyeong Jin
(University of New South Wales)
Scott D Liles
(University of New South Wales)
Krittika Kumar
(University of New South Wales)
Matthew J Rendell
(University of New South Wales)
Christopher Escott
(University of New South Wales)
Fay E Hudson
(University of New South Wales)
Wee Han Lim
(University of New South Wales)
Andrew S Dzurak
(University of New South Wales)
Alex R Hamilton
(University of New South Wales)
CMOS devices combine both n-type and p-type capabilities within the same chip to offer a route to integrate a high performance, stable electron charge sensor into a hole qubit device. The concept was recently demonstrated using a single electron transistor and a single hole transistor [4] - but a question remains whether a qubit with an ambipolar charge sensor can be fabricated. In this work, we fabricate an n-type charge sensor adjacent to a p-type double quantum dot. We show that this geometry allows sensing of the p-type double quantum dot system down to the last hole. We also demonstrate control of parameters that are essential to qubit operation, including control of the reservoir tunnel rates which can allow latched spin readout [5], as well as control of the interdot coupling rate which is essential for exchange qubit operation. These results show the feasibility of ambipolar CMOS charge sensing qubits.
[1] Crippa et al., Phys. Rev. Lett. (2018)
[2] Liles et al., arXiv. (2021)
[3] Liles et al., Nat. comms. (2018)
[4] Almeida et al., Phys. Rev. B (2020)
[5] Boganet al., Commun. Phys. (2019)
*This work was funded by the Australian Research Council (DP150100237, DP200100147, and FL190100167) and the US Army Research Office (W911NF-17-1-0198). Devices were made at the NSW node of the Australian National Fabrication Facility.
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