Bulletin of the American Physical Society
APS March Meeting 2022
Volume 67, Number 3
Monday–Friday, March 14–18, 2022; Chicago
Session A39: Superconducting and Semiconductor Qubits I/O, Packaging, and 3D Integration
8:00 AM–10:36 AM,
Monday, March 14, 2022
Room: McCormick Place W-196A
Sponsoring
Unit:
DQI
Chair: Jimmy Chen, Google
Abstract: A39.00005 : Scalable Quantum i/o: Advances in Integrated Cryogenic Microwave Components in Flexible Stripline Structures Part 1/2*
9:12 AM–9:24 AM
Presenter:
Kiefer Vermeulen
(Delft Circuits)
Authors:
Kiefer Vermeulen
(Delft Circuits)
Daniel Bouman
(Delft Circuits)
Ruben van Gulik
(Delft Circuits)
Chun Heung Wong
(Delft Circuits)
Wouter Bos
(Delft Circuits)
Nikolai Drobotun
(Delft Circuits)
Rob van den Brink
(Delft Circuits)
Jakob Kammhuber
(Delft Circuits)
Patrick Paluch
(Karlsruhe Institute of Technology)
Viktor Adam
(Karlsruhe Institute of Technology)
Wolfgang Wernsdorfer
(Karlsruhe Institute of Technology)
Ioan-Mihai Pop
(Karlsruhe Institute of Technology)
Vivien Thiney
(Institut Néel CNRS)
Laurent Colas
(Université de Sherbrooke)
Michel Pioro-Ladrière
(Université de Sherbrooke)
Marc-André Tétrault
(Université de Sherbrooke)
Daan Kuitebrouwer
(Delft Circuits)
Sal Bosman
(Delft Circuits)
In particular we focus on fully integrated low-pass filtering, metal-powder IR filtering and distributed attenuators with performances on-par with high-end coaxial solutions. We experimentally verify that the flat cabling is well-thermalized at cryogenic temperatures as low as 50mK. Finally we present the results of full two-port calibrated cryogenic microwave measurements performed on flexible superconducting RF hardware. In this first part of a two-part presentation, we introduce the flexible cabling concept and present fully integrated low-pass filtering, metal-powder IR filtering and distributed attenuators. As well as benchmarking measurements on state-of-the-art quantum devices.
*The development of Cri/oFlex®-3 is supported by the Horizon 2020 EIC Accelerator grant. Some of the research in this talk is part of the AVaQus project supported by the FET Open initiative from the European Union's Horizon 2020 research and innovation program.
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