Bulletin of the American Physical Society
70th Annual Gaseous Electronics Conference
Volume 62, Number 10
Monday–Friday, November 6–10, 2017; Pittsburgh, Pennsylvania
Session AM1: Linking Academia & Industry |
Hide Abstracts |
Chair: Julian Schulze, West Virginia University/Bochum University Room: Salon D |
Monday, November 6, 2017 9:00AM - 9:30AM |
AM1.00001: Characterization and diagnostics of RF plasmas under manufacturing conditions Michael Klick There are many problems in the industrial usage of plasma processes. For the semiconductor industry as one of the most important examples, there are the following main targets: chamber matching, minimizing the first wafer effect, optimizing chamber conditioning, fault detection and Fault classification, and pre-process impact. From the plasma science of view, the analysis of these effects leads often to problems as not well defined and basically unknown chamber wall state (varying heavily with product processed), chamber and gas heating affecting also the chamber wall state, plasma mode transitions (e.g., E-H-mode) and its detection. In the most of industrial environments, there is a permanent lack of information of the state of the plasma. What are potential solutions? 1. Simplified models where complex parts and unknown boundary conditions are replaced by parametrization through real-time and in-situ sensors. 2. Complementary real-time and in-situ plasma sensors. These ideas lead to some challenges which have to be discussed. Those are the requirement of characterization of the plasma close to the substrate and for manufacturing sites to have a basic knowledge of plasmas and minimum understanding or their own plasma processes. [Preview Abstract] |
Monday, November 6, 2017 9:30AM - 10:00AM |
AM1.00002: Progress on Voltage Waveform Tailoring for plasmas: From science to process, from lab to fab Erik Johnson, Sebastien Dine, Jean-Paul Booth The use of Tailored Voltage Waveforms for the excitation of asymmetric plasmas is a useful tool both for process control and to understand the physics behind surface treatments. It has unveiled knowledge about processes such as deposition, etch, surface passivation, cleaning, doping, and texturing. However, despite recent interest, any hope of a large-scale application of this technique by a risk-averse plasma-processing industry means a clear path to simple implementation must become obvious. The engineering challenges to using this technique come from its multi-frequency nature; one must couple multiple harmonics of an RF frequency efficiently, and precisely know their phase and amplitude when they interact with the plasma. Our group has focused on addressing the practical issues that risk slowing the adoption of this technique, namely (1) efficient and affordable power coupling, and (2) a straightforward technique for calibration. For power coupling, we have progressed on the concept of multi-frequency impedance matching, and I will discuss trade-offs in cost, complexity, and control. Concerning calibration (i.e. knowing the waveform that appears at the electrode), I will discuss our "minimally-intrusive" techniques to do so. [Preview Abstract] |
Monday, November 6, 2017 10:00AM - 10:30AM |
AM1.00003: The status of etching processes in semiconductor fabrication, and upcoming challenges. Jin-Young Bang, Sungil Cho Recently, etch processes have become increasingly important in semiconductor fabrication. Recent devices require very small critical dimensions and high aspect ratio contact holes or trenches. In terms of equipment, it should be designed to have high process accuracy, productivity and reproducibility. Therefore, a lot of efforts are made to secure the process capability and equipment stability in accordance with the development speed of semiconductor technology. In this presentation, the problems that arise in the latest semiconductor manufacturing are introduced from the viewpoint of process, equipment, and manufacturing. We will also discuss the new technologies requires to realize sub-10 nm and aspect ratio of 100 or more required for next-generation devices. [Preview Abstract] |
Monday, November 6, 2017 10:30AM - 11:00AM |
AM1.00004: Successes, Failures, and Lessons Learned Navigating Industry Supported Research in Academia Steven Shannon Collaborations between academia and industry can be very productive for both sides. The technical contributions of the research, access to new graduates trained in critical areas, and future revenue that can be generated by these partnerships are extremely attractive to industry. The monetary support for research endeavors and direct collaboration with industry researchers to identify science challenges in industry strengthen academic research endeavors. The opportunity to work alongside industry is extremely attractive for students and young scholars, many of whom seek to move into the private sector after graduation. With that come challenges in formalizing partnerships between academia and industry. Ownership of technology, vetting of publications, disparity in timescale expectations, and short term research agreements are only a few examples of pitfalls that can make compelling partnerships perish. In this talk, examples of collaborations between industry and academia from both the industry and academic perspective will be presented, focusing on what went right, what went wrong, and the evolution of a successful framework for these collaborations through these experiences. Identification of roadblocks and strategies for navigating partnerships through to formal research agreements will be presented. [Preview Abstract] |
Monday, November 6, 2017 11:00AM - 11:30AM |
AM1.00005: Application Perspective of Plasma Science and Technology for Food and Agriculture Wonho Choe, Cheorun Jo, Youbong Lim, Suk-Jae Yoo The plasma science and technology can bring about innovations in agriculture and food industries using the plasma's unique properties. As a part of the `\textit{Plasma Farming}', a comprehensive application of the plasma to the entire agricultural stages from farm to table, the application of~atmospheric pressure~plasma (APP) on the food industry~is promising. The APP can bring highly ensured safety and extended shelf-life, which would ultimately provide a comprehensive solution to challenges in the food industry. In this presentation, example-based discussions will be made particularly for the food safety, the food processing, and the novel smart plasma packaging. Food safety is undoubtedly of the highest priority for both food industry and consumers, and the APP can be a promising means. Several examples of antimicrobial effects of the plasma treatments will be discussed to show the plasma's role as an excellent non-thermal sterilization~means. In addition, the developed APP packaging technology can inactivate pathogens in packaged food by using a flexible pouch type plasma source, in which reactive oxygen and nitrogen species are produced from the ambient air inside the pouch. Another creative application of the APP is plasma treated water, which can be used as an alternative nitrite source---the most important curing agent of processed meat---along with the direct use of the plasma in the processed meat manufacturing. The requirements and conditions for developing appropriate plasma sources will also be discussed. [Preview Abstract] |
Monday, November 6, 2017 11:30AM - 12:00PM |
AM1.00006: The application of the multipole resonance probe to industrially relevant processes Moritz Oberberg, Marcel Fiebrandt, Stefan Ries, Christian Woelfel, Peter Awakowicz The Multipole Resonance Probe (MRP) has recently been introduced as a novel diagnostic for electron density measurements. Based on active plasma resonance spectroscopy (APRS), the probe measures a resonance whose frequency depends mainly on the electron density. Benchmark measurements in different low pressure plasmas are presented. \newline A lot of academic work such as modeling, simulations, and experiments was done in recent years to develop the MRP. Here, measurements in industrial processes such as sputtering and plasma ion assisted deposition (PIAD) are presented. Due to the ceramic tube surrounding the probe, it is very insensitive against dielectric coatings as long as the coating's thickness is small compared to the thickness of the ceramic tube. Thus, the MRP is a highly~functional~and fast diagnostic for such deposition processes, where other diagnostics, e. g. Langmuir probes, fail. It can be used for real-time process~monitoring and has been~tested in control loops to stabilize deposition processes. \newline Further challenges for both academia and industry are addressed such as the compensation of the rf modulated sheath as well as the search for actuation variables in control loops and the dependence of film properties on the control working point.~ \newline ~ [Preview Abstract] |
Follow Us |
Engage
Become an APS Member |
My APS
Renew Membership |
Information for |
About APSThe American Physical Society (APS) is a non-profit membership organization working to advance the knowledge of physics. |
© 2024 American Physical Society
| All rights reserved | Terms of Use
| Contact Us
Headquarters
1 Physics Ellipse, College Park, MD 20740-3844
(301) 209-3200
Editorial Office
100 Motor Pkwy, Suite 110, Hauppauge, NY 11788
(631) 591-4000
Office of Public Affairs
529 14th St NW, Suite 1050, Washington, D.C. 20045-2001
(202) 662-8700