Achieving Thin Glue Gaps in Target Fabrication*

The target fabrication group at General Atomics has developed a method using different vapor glues and liquids to bond components utilized for inertial fusion energy and high-energy density physics. The investigation associates with current targets fabricated for planar target assemblies and equation of state experiments. These components are constructed with high tolerances in respect to its surface flatness and roughness, the precision machining, and various elements that include high-density carbon to low-density foams. The thickness can range from 10’s to 100’s of microns. An essential characteristic to compare the experimental data to the simulated results is the specific glue applied despite being in a 3- dimensional build or a planar stack form. The most practical glue bond is to be very thin (<3 μm). The laser experiment may suffer from instabilities and shock reflections if too thick or non-uniform. Experiments are underway to characterize minimum glue bonds achievable in target assemblies with surface profilimetry, a precision assembly station, and high-resolution thickness measurement techniques.