Bulletin of the American Physical Society
2023 APS March Meeting
Volume 68, Number 3
Las Vegas, Nevada (March 5-10)
Virtual (March 20-22); Time Zone: Pacific Time
Session N74: Superconducting and Semiconductor Qubits I/O, Packaging, and 3D Integration I
11:30 AM–2:18 PM,
Wednesday, March 8, 2023
Room: Room 403/404
Sponsoring
Unit:
DQI
Chair: Joseph Glick, IBM TJ Watson Research Center
Abstract: N74.00006 : Flip-Chip Packaging of Fluxonium Qubits
12:54 PM–1:06 PM
Presenter:
Aaron Somoroff
(SEEQC, Inc.)
Authors:
Aaron Somoroff
(SEEQC, Inc.)
Patrick Truitt
(SEEQC, Inc.)
Adam Weis
(SEEQC, Inc.)
Konstantin Kalashnikov
(SEEQC, Inc.)
Jacob Bernhardt
(SEEQC, Inc.)
Igor Vernik
(SEEQC, Inc.)
Ray A Mencia
(University of Maryland, College Park)
Oleg Mukhanov
(SEEQC, Inc.)
Maxim G Vavilov
(UW-Madison)
Vladimir E Manucharyan
(University of Maryland, College Park & EPFL)
[1] Nguyen et al. Phys. Rev. X 9, 041041 (2019)
[2] Somoroff et al. arXiv:2103.08578 (2021)
[3] Ficheux et al. Phys. Rev. X 11, 021026 (2021)
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