Bulletin of the American Physical Society
2023 APS March Meeting
Volume 68, Number 3
Las Vegas, Nevada (March 5-10)
Virtual (March 20-22); Time Zone: Pacific Time
Session N74: Superconducting and Semiconductor Qubits I/O, Packaging, and 3D Integration I
11:30 AM–2:18 PM,
Wednesday, March 8, 2023
Room: Room 403/404
Sponsoring
Unit:
DQI
Chair: Joseph Glick, IBM TJ Watson Research Center
Abstract: N74.00004 : A 3-tier stack for 3D integration of superconducting quantum systems – part 1: Interposer tier with superconducting TSVs and qubits*
12:30 PM–12:42 PM
Presenter:
Donna-Ruth W Yost
(MIT - Lincoln Laboratory)
Authors:
Donna-Ruth W Yost
(MIT - Lincoln Laboratory)
Cyrus F Hirjibehedin
(MIT Lincoln Lab)
Justin L Mallek
(MIT Lincoln Lab)
Danna Rosenberg
(Massachusetts Institute of Technology MIT)
Rabindra Das
(Massachusetts Institute of Technology MIT)
Kate Azar
(MIT Lincoln Laboratory)
Katrina Silwa
(MIT Lincoln Laboratory)
Thomas M Hazard
(MIT Lincoln Lab)
Vladimir Bolkhovsky
(MIT Lincoln Laboratory)
Evan Golden
(MIT Lincoln Laboratory)
David K Kim
(MIT Lincoln Lab)
Jeffrey Knecht
(MIT Lincoln Laboratory)
Alexander Melville
(MIT Lincoln Laboratory)
Bethany Niedzielski
(MIT Lincoln Laboratory)
Meghan Schuldt
(MIT Lincoln Laboratory)
Ravi Rastogi
(MIT Lincoln Laboratory)
Kyle Serniak
(MIT Lincoln Laboratory)
Steven J Weber
(MIT Lincoln Lab)
Wayne Woods
(MIT Lincoln Lab)
Scott Zarr
(MIT Lincoln Laboratory)
Andrew J Kerman
(MIT Lincoln Lab)
William D Oliver
(Massachusetts Institute of Technology MIT)
Mollie E Schwartz
(MIT Lincoln Laboratory)
Jonilyn L Yoder
(MIT Lincoln Lab)
*This work is supported by a collaboration between the U.S. Department of Energy, Office of Science, National Quantum Information Science Research Centers, Quantum Systems Accelerator; the Defense Advanced Research Projects Agency; and the Under Secretary of Defense for Research and Engineering under Air Force Contract No. FA8702-15-D-0001. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the Department of Energy, the Under Secretary of Defense for Research and Engineering, or the Defense Advanced Research Projects Agency.
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