Bulletin of the American Physical Society
APS March Meeting 2018
Volume 63, Number 1
Monday–Friday, March 5–9, 2018; Los Angeles, California
Session T60: Poster Session III
1:00 PM,
Thursday, March 8, 2018
LACC
Room: West Hall A
Abstract ID: BAPS.2018.MAR.T60.303
Abstract: T60.00303 : Long-term reliability of Pb-free solder joint between copper interconnect and silicon in photovoltaic solar cell
Presenter:
Marco Fronzi
(IRCRE, Xi'an Jiaotong University)
Authors:
Marco Fronzi
(IRCRE, Xi'an Jiaotong University)
Omid Mokhtari
(Joining and Welding Research Institute , Osaka University)
Yunjiang Wang
(Institute of Mechanics, Chinese Academy of Sciences)
Hiroshi Nishikawa
(Joining and Welding Research Institute , Osaka University)
This study aims to expand the lifetime of the PV solar modules by reducing the possibility of the formation of cracks, by the addition of a minor alloying element.
To understand the possible crack formation in the resulting systems, we evaluate:
1) the theoretical CTE of the Ag3Sn and the newly formed IMC layer by a first-principles investigation.
2) the thermal stress distribution throughout the solder/Ag interface including the interface of the IMC layers by molecular dynamics simulations.
3) the experimental evaluation of possible crack in the joint.
To cite this abstract, use the following reference: http://meetings.aps.org/link/BAPS.2018.MAR.T60.303
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