3D Integration for Superconducting Qubits: Part 1*

As the field of superconducting quantum computing advances from the few-qubit scale, it will become increasingly important to develop techniques for addressing large number of qubits without degrading their performance. 3D integration can alleviate interconnect crowding and enable the construction of large-scale arrays of coupled coherent superconducting qubits. I will present our recent work on developing and characterizing 3D integration components for quantum annealing, including indium bumps and superconducting through-silicon vias, and discuss progress towards building 3D integrated coupled qubits.