Bulletin of the American Physical Society
APS March Meeting 2017
Volume 62, Number 4
Monday–Friday, March 13–17, 2017; New Orleans, Louisiana
Session H46: 3D Integration and Packaging of Superconducting Qubits |
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Sponsoring Units: GQI Chair: John Martinis, Google and University of California Room: 393 |
Tuesday, March 14, 2017 2:30PM - 2:42PM |
H46.00001: 3D Integration for Superconducting Qubits Danna Rosenberg, David Kim, Donna-Ruth Yost, Justin Mallek, Jonilyn Yoder, Rabindra Das, Livia Racz, David Hover, Steven Weber, Andrew Kerman, William Oliver Superconducting qubits are a prime candidate for constructing a large-scale quantum processor due to their lithographic scalability, speed, and relatively long coherence times. Moving beyond the few qubit level, however, requires the use of a three-dimensional approach for routing control and readout lines. 3D integration techniques can be used to construct a structure where the sensitive qubits are shielded from a potentially-lossy readout and interconnect chip by an intermediate chip with through-substrate vias, with indium bump bonds providing structural support and electrical conductivity. We will discuss our work developing 3D-integrated coupled qubits, focusing on the characterization of 3D integration components and the effects on qubit performance and design. This research was funded by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) via MIT Lincoln Laboratory under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of ODNI, IARPA, or the US Government. [Preview Abstract] |
Tuesday, March 14, 2017 2:42PM - 2:54PM |
H46.00002: Silicon Hard-Stop Mesas for 3D Integration of Superconducting Qubits David Kim, Danna Rosenberg, Brenda Osadchy, Greg Calusine, Rabindra Das, Alexander Melville, Jonilyn Yoder, Donna-Ruth Yost, Livia Racz, William Oliver As quantum computing with superconducting qubits advances past the few-qubit stage, implementing 3D packaging/integration to route readout/control lines will become increasingly important. One approach is to bond chips that perform different functions using indium bump bonds. Because indium is malleable, however, achieving the desired spacing and tilt between two chips can be challenging. We present an approach based on etching several microns into the silicon substrate to produce hard stop silicon posts. Since this process involves etching into a pristine substrate, it is essential to evaluate its impact on qubit performance. We report the etched surface's effect on the resonator quality factor and qubit coherence time, as well as the improvement in planarity and tilt. This research was funded in part by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) and by the Assistant Secretary of Defense for Research {\&} Engineering under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of ODNI, IARPA, or the US Government. [Preview Abstract] |
Tuesday, March 14, 2017 2:54PM - 3:06PM |
H46.00003: Bridging the Gap for High-Coherence, Strongly Coupled Superconducting Qubits Jonilyn Yoder, David Kim, Peter Baldo, Alexandra Day, George Fitch, Eric Holihan, David Hover, Gabriel Samach, Steven Weber, William Oliver Crossovers can play a critical role in increasing superconducting qubit device performance, as long as device coherence can be maintained even with the increased fabrication and circuit complexity. Specifically, crossovers can (1) enable a fully-connected ground plane, which reduces spurious modes and crosstalk in the circuit, and (2) increase coupling strength between qubits by facilitating interwoven qubit loops with large mutual inductances. Here we will describe our work at MIT Lincoln Laboratory to integrate superconducting air bridge crossovers into the fabrication of high-coherence capacitively-shunted superconducting flux qubits. We will discuss our process flow for patterning air bridges by resist reflow, and we will describe implementation of air bridges within our circuits. This research was funded in part by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) and by the Assistant Secretary of Defense for Research and Engineering under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of ODNI, IARPA, or the US Government. [Preview Abstract] |
Tuesday, March 14, 2017 3:06PM - 3:18PM |
H46.00004: Airbridges for scalable microwave control of superconducting qubits Michael T. Fang, Andrew J. Keller, Oskar J. Painter Multi-qubit Xmon devices with high fidelity control and readout show a promising architecture for quantum information processing. However, complexity in circuit design and layout prevents simple routing of microwave lines as the interconnectivity of qubits increases. This complexity is due to suppressing parasitics such as microwave crosstalk and slotline modes. We propose and demonstrate a technique for fabricating robust superconducting aluminum airbridges using electron beam lithography to suppress slotline modes. We extend the practical use of airbridges with ``hop-overs''. Hop-overs allow microwave lines to cross paths with reduced crosstalk while enabling readout and control of many qubits as an alternative for flip chip or through-chip via techniques. [Preview Abstract] |
Tuesday, March 14, 2017 3:18PM - 3:30PM |
H46.00005: Engineering scalable fault-tolerant quantum computation Mollie Kimchi-Schwartz, Rosenberg Danna, David Kim, Jonilyn Yoder, Morten Kjaergaard, Rabindra Das, Jeff Grover, Simon Gustavsson, William Oliver Recent demonstrations of quantum protocols comprising on the order of 5-10 superconducting qubits are foundational to the future development of quantum information processors. A next critical step in the development of resilient quantum processors will be the integration of coherent quantum circuits with a hardware platform that is amenable to extending the system size to hundreds of qubits and beyond. In this talk, we will discuss progress toward integrating coherent superconducting qubits with signal routing via the third dimension. This research was funded in part by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) and by the Assistant Secretary of Defense for Research & Engineering under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of ODNI, IARPA, or the US Government. [Preview Abstract] |
Tuesday, March 14, 2017 3:30PM - 3:42PM |
H46.00006: 3D integration of superconducting qubits with bump bonds: Part 1 J. Mutus, B. Foxen, E. Lucero, J. Kelly, Y. Yang, A. Yu, M. Baldwinson, Z. Chen, B. Chiaro, A. Dunsworth, C. Neill, C. Quintana, J. Wenner, John. M. Martinis Advanced fabrication techniques focusing on eliminating lossy dielectrics and meticulously cleaning interfaces have enabled increased quantum coherence in superconducting quantum bits (qubits). However, in order to architect a large system of interconnected qubits, dense control lines must be routed in 3D while preserving qubit coherence. We report on our development of superconducting-indium-bump flip-chip technology for connecting a multi-layer signal routing carrier chip to a pristine qubit chip. We will report on process development for integrating indium into our qubit fabrication as well as the performance of this superconducting link from DC to microwave frequencies. [Preview Abstract] |
Tuesday, March 14, 2017 3:42PM - 3:54PM |
H46.00007: 3D integration of superconducting qubits with bump bonds: Part 2 Julian Kelly, J. Mutus, E. Lucero, B. Foxen, R. Graff, P. Klimov, Z. Chen, B. Chiaro, A. Dunsworth, C. Neill, C. Quintana, J. Wenner, John. M. Martinis Planar superconducting qubits have recently made great strides in coherence and control, securing them as a contender for practical computing applications. However, single-layer geometries restrict the routing of wiring elements used for control and readout, hampering the development of complex architectures with high connectivity. Here, we demonstrate the successful integration of superconducting Xmon transmon qubits with superconducting bump bonds in a flip-chip architecture, and report on development of the necessary integration technology for scalable two-dimensional arrays of qubits. [Preview Abstract] |
Tuesday, March 14, 2017 3:54PM - 4:06PM |
H46.00008: 3D integration of superconducting qubits with bump bonds: Part 3 Erik Lucero, E. Jeffrey, A. Vainsencher, P. Klimov, T. Huang, Z. Chen, B. Chiaro, A. Dunsworth, B. Foxen, C. Neill, C. Quintana, J. Wenner, John. M. Martinis 3D integration doesn’t end at the Silicon. Superconducting flip-chip qubit architectures require microwave engineered packaging, high density signal delivery, and cost effective control hardware. We report on our bottom-to-the-top full system architecture from 10 mKelvin to 300 Kelvin. Our report includes solutions to reduce microwave crosstalk, deliver nearly 1000 coaxial lines to base, and arbitrary waveform generators with complete per channel costs under \$2k. These developments form the scalable control solutions for our near term 50 qubit quantum supremacy demonstrations and beyond. [Preview Abstract] |
Tuesday, March 14, 2017 4:06PM - 4:18PM |
H46.00009: Quantum Devices Bonded Beneath a Superconducting Shield: Part 1 C.T. Earnest, C.R. McRae, A.O. Abdallah, J.H. B{\'e}janin, T.G. McConkey, Z. Pagel, M. Mariantoni Scalability is crucial for the progression of fault-tolerant quantum computing, as error correction requires a large array of quantum bits (qubits). In the superconducting circuit imple- mentation, growth in circuit size necessitates an increase in chip size, which introduces a host of practical issues including box and slot modes. One solution is to bond a tunneled, metallized shielding layer above the circuit, which would also act as a solution to cross-talk and provide a platform for cold on-chip electronics. In this talk, we propose the use of aluminium superconducting circuits coated in indium, shielded by isotropically etched indium tunnels, and bonded thermocompressively in vacuum. We elucidate the design and fabrication of both the bottom device chip and top shield chip, and divulge details of the novel bonding method used to attach the two in- dium thin films. We also consider the effect of the bonding conditions on Josephson Junctions, and propose a precise indium removal method that would leave behind clean aluminium devices. [Preview Abstract] |
Tuesday, March 14, 2017 4:18PM - 4:30PM |
H46.00010: Quantum Devices Bonded Beneath a Superconducting Shield: Part 2 Corey Rae McRae, Adel Abdallah, Jeremy Bejanin, Carolyn Earnest, Thomas McConkey, Zachary Pagel, Matteo Mariantoni The next-generation quantum computer will rely on physical quantum bits (qubits) organized into arrays to form error-robust logical qubits. In the superconducting quantum circuit implementation, this architecture will require the use of larger and larger chip sizes. In order for on-chip superconducting quantum computers to be scalable, various issues found in large chips must be addressed, including the suppression of box modes (due to the sample holder) and the suppression of slot modes (due to fractured ground planes). By bonding a metallized shield layer over a superconducting circuit using thin-film indium as a bonding agent, we have demonstrated proof of concept of an extensible circuit architecture that holds the key to the suppression of spurious modes. Microwave characterization of shielded transmission lines and measurement of superconducting resonators were compared to identical unshielded devices. The elimination of box modes was investigated, as well as bond characteristics including bond homogeneity and the presence of a superconducting connection. [Preview Abstract] |
Tuesday, March 14, 2017 4:30PM - 4:42PM |
H46.00011: Control and Measurement of an Xmon with the Quantum Socket T.G. McConkey, J.H. Bejanin, C.T. Earnest, C.R.H. McRae, J.R. Rinehart, M. Weides, M. Mariantoni The implementation of superconducting quantum processors is rapidly reaching scalability limitations. Extensible electronics and wiring solutions for superconducting quantum bits (qubits) are among the most imminent issues to be tackled. The necessity to substitute planar electrical interconnects (e.g., wire bonds) with three-dimensional wires is emerging as a fundamental pillar towards scalability. In a previous work, we have shown that three-dimensional wires housed in a suitable package [1], named the quantum socket, can be utilized to measure high-quality superconducting resonators. In this work, we set out to test the quantum socket with actual superconducting qubits to verify its suitability as a wiring solution in the development of an extensible quantum computing architecture. To this end, we have designed and fabricated a series of Xmon qubits. The qubits range in frequency from about 6 to 7 GHz with anharmonicity of 200 MHz and can be tuned by means of Z pulses. Controlling tunable Xmons will allow us to verify whether the three-dimensional wires contact resistance is low enough for qubit operation. Qubit T1 and T2 times and single qubit gate fidelities are compared against current standards in the field. [1] J.H. B\'{e}janin \textit{et al}., Phys. Rev. Applied \textbf{6}, 044010 (2016) [Preview Abstract] |
Tuesday, March 14, 2017 4:42PM - 4:54PM |
H46.00012: Design and Implementation of Multi-Qubit 3D Quantum Integrated Circuits Andrew Bestwick, Alexander Papageorge, Matt Reagor, Chad Rigetti We present a superconducting integrated quantum circuit architecture that enables the high-fidelity measurement and control of multi-qubit devices. Superconducting through-silicon vias and 3D isolation caps allow for scalable circuits without tradeoffs in signal integrity, forming a platform for the implementation of a wide range of on-chip functionality. When combined with efficient, robust signal delivery and instrumentation, this approach can be scaled for sophisticated quantum information applications. [Preview Abstract] |
Tuesday, March 14, 2017 4:54PM - 5:06PM |
H46.00013: High Coherence Qubit packaging David P. Pappas, Xian Wu, Salvatore B. Olivadese, V. P. Adiga, Jared B. Hertzberg, Nicholas T. Bronn, Jerry M. Chow Development of sockets and associated interconnects for multi-qubit chips is presented. Considerations include thermalization, RF hygiene, non-magnetic environment, and self-alignment of the chips to allow for rapid testing, scalable integration, and high coherence operation. The sockets include wirebond free, vertical~ take-off launches with pogopins. This allows for high interconnectivity to non-trivial topology of qubits. Furthermore, vertical grounding is accomplished to reduce chip modes and suppress box modes. Low energy loss and high phase coherence is observed using this paradigm. [Preview Abstract] |
Tuesday, March 14, 2017 5:06PM - 5:18PM |
H46.00014: Micromachined integrated quantum circuit containing a superconducting qubit Teresa Brecht, Yiwen Chu, Christopher Axline, Wolfgang Pfaff, Jacob Blumoff, Kevin Chou, Lev Krayzman, Luigi Frunzio, Robert Schoelkopf We demonstrate a functional multilayer microwave integrated quantum circuit (MMIQC\footnote{T. Brecht, \textit{et al.}, Npj: quantum information \textbf{2}, 16002 (2016)}). This novel hardware architecture combines the high coherence and isolation of three-dimensional structures with the advantages of integrated circuits made with lithographic techniques. We present fabrication and measurement of a two-cavity/one-qubit prototype, including a transmon coupled to a three-dimensional microwave cavity micromachined in a silicon wafer. It comprises a simple MMIQC with competitive lifetimes and the ability to perform circuit QED operations in the strong dispersive regime. Furthermore, the design and fabrication techniques that we have developed are extensible to more complex quantum information processing devices. [Preview Abstract] |
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