Bulletin of the American Physical Society
2006 APS March Meeting
Monday–Friday, March 13–17, 2006; Baltimore, MD
Session U4: Lithography |
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Sponsoring Units: DPOLY Chair: Vivek Prabhu, National Institute of Standards and Technology, Polymers Division Room: Baltimore Convention Center 308 |
Thursday, March 16, 2006 8:00AM - 8:36AM |
U4.00001: Step and Flash Imprint Lithography Invited Speaker: Step and Flash Imprint Lithography has been recognized as a potentially low cost, high resolution patterning technique. Most of the published development work has been directed toward tool design and processing techniques. This work will be reviewed. There remains a tremendous opportunity and need to develop new materials for specific SFIL applications. An overview of relevant materials-related development work for SFIL lithographic applications will be presented. Material requirements for SFIL patterning for the sub-50 nm integrated circuit regime are discussed along with proposed new imprint applications, such as imprintable dielectrics that are targeted for use as on chip insulation layers. [Preview Abstract] |
Thursday, March 16, 2006 8:36AM - 9:12AM |
U4.00002: Will optical lithography live forever? Invited Speaker: |
Thursday, March 16, 2006 9:12AM - 9:48AM |
U4.00003: Directed assembly of block copolymer containing materials on chemically nanopatterned substrates: a platform for two and three-dimensional nanofabrication Invited Speaker: Directed assembly often refers to fabrication strategies that involve the organization of one or more materials on substrates through specific interactions with patterned activated regions. Based on engineered interfacial interactions between lithographically-defined chemically nanopatterned substrates and block copolymer thin films, the domain structure of the films can be directed to assembly into defect free periodic and non-regular structures over large areas, with each structure registered with the underlying substrate. Advantages of integrating self-assembling materials into the lithographic process, particularly for the fabrication of nanoelectronic devices, include sub 1 nm control over feature dimensions, reduced line edge roughness, and the opportunity to scale the approach to pattern at dimensions of 10 nm and below. Exciting opportunities exist to extend the use of self-assembling materials in conjunction with two-dimensionally (2D) patterned activate surfaces for the fabrication complex three-dimensional (3D) materials. Arrays of functional nanoparticles, for example, can be directed to assemble using block copolymer/particle nanocomposites or in a hierarchical process using chemically functional polymers followed by in situ particle synthesis. 3D bicontinuous morphologies in which the two phases of the assembly are readily addressable, a geometrically complex structure, can be created using materials that normally form lamellae and directing them to assemble on chemically patterned surfaces consisting of square arrays of spots. The principal concept of this work is that high value added 3D structures can be created from simple 2D templates, retaining the lithographic properties of perfection and registration for applications where input and output connections to the structures are required. [Preview Abstract] |
Thursday, March 16, 2006 9:48AM - 10:24AM |
U4.00004: Probing the 3-Dimensional Structure of Nanomanufactured Materials using CD-SAXS Invited Speaker: The realization of routine nanofabrication will demand new measurement platforms capable of probing the size, shape, internal morphology, and chemical uniformity of structures ranging from nanometers to 100's of nanometers in size. Traditional microscopies such as scanning electron microscopy and atomic force microscopy are often limited to exposed surfaces and are challenged to probe internal morphologies and structures with complex 3-dimensional shapes. We have developed a platform for non-destructive characterization of repeating nanostructures or nanostructured materials applicable to a wide range of sizes (5 to 500 nm) and materials (polymers, ceramics, and metals). Critical Dimension Small Angle X-ray Scattering (CD-SAXS) utilizes a relatively high energy, collimated x-ray beam to probe the dimensions, shape, and homogeneity of nanostructures fabricated on substrates such as silicon or quartz with sub-nm precision. CD-SAXS is capable of non-destructive measurements in real time during fabrication, providing insight into a wide range of fabrication methods. We demonstrate the wide ranging capabilities of CD-SAXS using recent data from structures created with photolithography, nanoimprint, and self-assembly. Patterns are characterized in terms of their average width, height, sidewall angle, and chemical uniformity. In addition, the distribution in orientation is quantified for self-organized systems, providing insights into the factors controlling defects. Finally, the technique is demonstrated for complex systems involving pattern directed self-assembly, such as in nanoimprinted block copolymers. In these systems, confinement between a mold and substrate prevent conventional imaging during fabrication. Real time data are used to elucidate the evolution of nanometer scale structures within 100 nm scale cavities. [Preview Abstract] |
Thursday, March 16, 2006 10:24AM - 11:00AM |
U4.00005: Characterization of Materials for Nanoscale Lithography Invited Speaker: Current state-of-the-art semiconductor devices are fabricated at dimensions below 100 nm and industry planning anticipates that devices at the 20 nm scale will be in production a decade from now. The sizes of the component molecules of typical polymeric photoresists are of this same magnitude, and due to this convergence of scales and intrinsic materials limitations, the formation of high fidelity relief images at these dimensions will be a significant challenge. We summarize here the materials issues that must be addressed to enable the practical application of nanoscale photolithography, and describe instrumentation and methods we have developed that allow their suitability for such use to be assessed by characterizing basic materials properties. [Preview Abstract] |
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